WHDI 2nd Gen Wireless 1080p Chipset from AMIMON Product News 4/29/2009 Post a comment AMIMON Inc. announced the immediate availability of its second generation baseband chipset. The second generation transmitter and receiver chips (AMN 2120/2220) are designed for the WHDI (Wireless Home Digital Interface) standard.
Bluetooth upgrade rides 802.11 radios News & Analysis 4/21/2009 Post a comment The Bluetooth Special Interest Group has released its version 3.0 specification supporting data rates up to 24 Mbits/second over a shared 802.11 radio, a small but significant step toward the technology becoming a de facto protocol for ad hoc, secure wireless peer-to-peer networks.
TSMC rolls sign-off flow, RF design kit Product News 4/21/2009 Post a comment Seeking to accelerate the product development process, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is rolling out a one-two punch in the arena: It has unveiled a mixed-signal/RF design kit as well as a foundry-specific integrated sign-off flow.
Faster code generation for wireless sensor networks Design How-To 4/16/2009 Post a comment Wireless sensor networks (WSN) have become a hot research topic and show much promise to become a driver of current and future microelectronic technologies. This emerging technology offers exciting potential for numerous application areas including environmental, medical, military, transportation, entertainment and crisis management.
Analyst: Chip delays could slow Verizon's LTE rollout News & Analysis 4/8/2009 Post a comment A research note from Deutsche Bank has cast doubts over the ability of early adopter Verizon Wireless to launch a 4G Long-Term Evolution network in up to 35 markets in the U.S. by the end of next year using datacards, and suggests handsets may be even longer delayed.
Company Spotlight on SiGe Semiconductor Design How-To 4/6/2009 Post a comment SiGe Semiconductor's Stefan Fulga provides insight into the mobile industry related to SiGe's Amplifiers, Front end Modules (FEMs) which integrate filtering, LNA switches and preamplifiers along with power amplifiers for 802.11a/b/g/n WiFi, Bluetooth, WiMax, and highly integrated GPS radio receivers.
RF in Action: Mobile Phones on the High Seas Design How-To 4/6/2009 Post a comment There are no network towers in the middle of oceans. There are no phone lines trailing the international cruise ships that dot large waterways. But there are thousands of tourists making long-distance cruises every year.
Overcoming LTE PHY Design Challenges Using ESL Design Methodologies Design How-To 4/5/2009 Post a comment Electronic System Level (ESL) design aims to be this comprehensive design and verification methodology and this article aims to introduce some of the design challenges that may be encountered in designing the physical layer (PHY) for LTE and how ESL tools can help create executable specs to overcome them.
Infineon claims first SDR chipset for sky and ground Product News 4/1/2009 Post a comment Infineon Technologies AG, has announced that a multi-standard mobile platform has been created based on Infineon-developed software-defined-radio technology. The SDR-enabled satellite-terrestrial handsets will operate with multiple cellular and satellite-based communications technologies including GSM, GPRS, EDGE, WCDMA, HSDPA, HSUPA and GMR1-2G/3G.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.