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Content tagged with RF/Microwave
posted in April 2009
Using the PSP Model in CMOS RFIC Design (Part 2 of 2)
Design How-To  
4/30/2009   2 comments
Understand how the Penn State Philips (PSP) transistor model (an alternative to traditional BSIM models) relates to actual device behavior in CMOS RFIC design, and how these models are used in an RF process design kit (PDK)
Wireless rivals vie to replace IR remote controls
News & Analysis  
4/29/2009   1 comment
The Bluetooth 3.0 spec adds a feature which enables wireless remote controls to use Bluetooth, but RF4CE is specifically designed to replace IR remote controls with a wireless alternative.
WHDI 2nd Gen Wireless 1080p Chipset from AMIMON
Product News  
4/29/2009   Post a comment
AMIMON Inc. announced the immediate availability of its second generation baseband chipset. The second generation transmitter and receiver chips (AMN 2120/2220) are designed for the WHDI (Wireless Home Digital Interface) standard.
Antenna line expands with 2.4-GHz versions
Product News  
4/29/2009   Post a comment
Antenna Factor is offering 2.4GHz versions of its PW and CW series dipole antennas that are well suited for a wide range of industrial, medical, sporting and consumer applications.
Integrated modulator reduces component count in broadband satellite apps
Product News  
4/22/2009   Post a comment
ADI's ADRF6750 modulator saves space, reduces cost, and lowers complexity by integrating an analog I/Q quadrature modulator, fractional-N PLL (phase locked loop) synthesizer, VCO (voltage controlled oscillator) and digitally controlled RF attenuator, all within an 8 mm x 8 mm LFCSP package.
Infineon supplies EDGE platform to Nokia
News & Analysis  
4/22/2009   1 comment
Chip vendor Infineon has expanded its existing supply relationship to mobile handset vendor Nokia. The company will provide its XMM 2130 EDGE platform.
Bluetooth upgrade rides 802.11 radios
News & Analysis  
4/21/2009   Post a comment
The Bluetooth Special Interest Group has released its version 3.0 specification supporting data rates up to 24 Mbits/second over a shared 802.11 radio, a small but significant step toward the technology becoming a de facto protocol for ad hoc, secure wireless peer-to-peer networks.
TSMC rolls sign-off flow, RF design kit
Product News  
4/21/2009   Post a comment
Seeking to accelerate the product development process, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is rolling out a one-two punch in the arena: It has unveiled a mixed-signal/RF design kit as well as a foundry-specific integrated sign-off flow.
Atomic clock accuracy boosted
News & Analysis  
4/20/2009   Post a comment
A strontium-based timekeeper providing up to 50 percent better accuracy could serve as the next-generation atomic clock.
TI claims fastest dual 14-bit ADC
Product News  
4/20/2009   Post a comment
TI has developed a dual, 14-bit analog-to-digital converter that it says delivers that industry's fastest sample rate at 250 MSPS.
Probing and calibration for accurate baseband I/Q measurements
Design How-To  
4/20/2009   Post a comment
Understand how the choice of probes and calibration procedure affects quality of baseband in-phase and quadrature signal measurement
Faster code generation for wireless sensor networks
Design How-To  
4/16/2009   Post a comment
Wireless sensor networks (WSN) have become a hot research topic and show much promise to become a driver of current and future microelectronic technologies. This emerging technology offers exciting potential for numerous application areas including environmental, medical, military, transportation, entertainment and crisis management.
Company Spotlight on ComSys
Design How-To  
4/13/2009   Post a comment
Ehud Reshef talks about the Mobile WiMax industry, where it is at today and where it is going tomorrow.
Resolving test challenges for emerging wireless designs
Design How-To  
4/12/2009   Post a comment
Understand some of the issues which impact testing of mixed-signal and RF packages
Bluetooth SIG set to unveil version 3.0 this month
News & Analysis  
4/10/2009   Post a comment
The industry group that promotes Bluetooth said the next version of the short-range wireless standard will be unveiled later this month.
Analyst: Chip delays could slow Verizon's LTE rollout
News & Analysis  
4/8/2009   Post a comment
A research note from Deutsche Bank has cast doubts over the ability of early adopter Verizon Wireless to launch a 4G Long-Term Evolution network in up to 35 markets in the U.S. by the end of next year using datacards, and suggests handsets may be even longer delayed.
Dual RF LDMOS bias controllers offer integration, reduce cost with power savings
Product News  
4/6/2009   Post a comment
At 7mm x 7mm, Maxim says its latest devices are the industry's smallest LDMOS bias controllers to integrate all of the analog-to-digital and digital-to-analog interfaces and logic functions required for cellular base-station control.
13.5-16 GHz GaAs MMIC PA delivers 10W output power
Product News  
4/6/2009   Post a comment
Mimx Broadband's dual-sided bias amplifier achieves 17 dB gain and +48 dBm OIP3.
Company Spotlight on SiGe Semiconductor
Design How-To  
4/6/2009   Post a comment
SiGe Semiconductor's Stefan Fulga provides insight into the mobile industry related to SiGe's Amplifiers, Front end Modules (FEMs) which integrate filtering, LNA switches and preamplifiers along with power amplifiers for 802.11a/b/g/n WiFi, Bluetooth, WiMax, and highly integrated GPS radio receivers.
RF in Action: Mobile Phones on the High Seas
Design How-To  
4/6/2009   Post a comment
There are no network towers in the middle of oceans. There are no phone lines trailing the international cruise ships that dot large waterways. But there are thousands of tourists making long-distance cruises every year.
Overcoming LTE PHY Design Challenges Using ESL Design Methodologies
Design How-To  
4/5/2009   Post a comment
Electronic System Level (ESL) design aims to be this comprehensive design and verification methodology and this article aims to introduce some of the design challenges that may be encountered in designing the physical layer (PHY) for LTE and how ESL tools can help create executable specs to overcome them.
Test system targets spurious WiMAX signals
Product News  
4/4/2009   Post a comment
The R&S TS8977's automated test sequences ensure high efficiency by making user control unnecessary during the time-consuming measurements of conducted spurious emissions.
Adobe and TI bring Flash and AIR to OMAP platform
Product News  
4/4/2009   Post a comment
The collaboration allows developers to fully leverage the benefits of the OMAP platform to reduce time to market while increasing performance and reducing power on devices.
Top 22 operators account for 50% of total WiMAX subscribers
News & Analysis  
4/4/2009   Post a comment
The 22 include well-known operators such as Clearwire and operators that currently have a relatively small subscriber base but which Maravedis believes there is great potential, such as Scartel (Russia).
Freescale and SMK deliver RF4CE remote controls
News & Analysis  
4/4/2009   1 comment
Implementing the IEEE 802.15.4 standard, SMK demonstrated Freescale's RF4CE technology targeted at DTV, Blu-ray DVD recorders, and set top boxes.
MIT harnesses viruses to print 'green' batteries
News & Analysis  
4/2/2009   Post a comment
Viruses can be used to assemble tiny batteries that can then be printed on plastic films, Massachusetts Institute of Technology researchers claim.
Advances in wireless, sensors, MEMs set to boost energy harvesting
News & Analysis  
4/2/2009   Post a comment
A confluence of the development of wireless and lower power electronics, along with advancements in sensors and MEMS, is fundamentally changing today's energy harvesting market.
Infineon claims first SDR chipset for sky and ground
Product News  
4/1/2009   Post a comment
Infineon Technologies AG, has announced that a multi-standard mobile platform has been created based on Infineon-developed software-defined-radio technology. The SDR-enabled satellite-terrestrial handsets will operate with multiple cellular and satellite-based communications technologies including GSM, GPRS, EDGE, WCDMA, HSDPA, HSUPA and GMR1-2G/3G.


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Max Maxfield

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1 Comment
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David Blaza
5 comments
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