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Content tagged with RF/Microwave
posted in May 2010
Wireless mesh network chipset targets smart lighting
Product News  
5/31/2010   Post a comment
Semtech and Virtual Extension have announced a two-chip wireless mesh network chipset that brings a new level of performance and signal robustness to smart lighting applications.
Digi launches out-of-the-box M2M cloud connectivity for embedded platforms
Product News  
5/31/2010   Post a comment
Digi International has announced that all Digi and Rabbit embedded products will be configured to easily connect to the iDigi "cloud" out of the box.
Wi-Fi IC shipments set to grow 33% in 2010, says ABI
News & Analysis  
5/28/2010   Post a comment
Global shipments of Wi-Fi ICs are forecast to surpass 770 million units in 2010, up almost 33 percent compared to 2009, according to the ABI Research wing of Allied Business Intelligence Inc.
2.4-GHz RF SoC delivers CD-quality wireless audio
Product News  
5/25/2010   Post a comment
Targeted at consumer, portable and high-end audio applications, TI says the first RF device in its new PurePath Wireless product line can reduce bill of materials cost by 50 percent.
IBM, MediaTek to debut 60-GHz chipset
News & Analysis  
5/24/2010   Post a comment
IBM and MediaTek plan to debut their 60-GHz transceiver chipset at the IEEE Radio Frequency Integrated Circuit Symposium in Anaheim, Calif.
Clients to become more like servers, says ARM's CTO
News & Analysis  
5/24/2010   Post a comment
Processors for mobile clients are going to have to take on many of the functions associated with networking infrastructure, according to Mike Muller, chief technology officer of ARM. This will be part of an explosion of processing requirements for wirelessly-connected devices that will require multiple application-specific processors to keep power consumption down, he added.
Integrated baluns shrink Bluetooth antenna connection
Product News  
5/24/2010   Post a comment
Two passive ICs from STMicroelectronics NV allow designers to connect an antenna to a Bluetooth transceiver using a single chip.
12-bit ADC clocks 3.6 Gsps with nearly invisible noise floor, strong noise power ratio and IMD
Product News  
5/24/2010   Post a comment
National Semiconductor ADC12D1800 family tops out with -147 dBm/Hz NF, 52 dB NPR, -61 dBFS IMD
An overview of the LTE physical layer--Part I
Design How-To  
5/24/2010   Post a comment
This article presents an overview of the LTE physical layer with a focus on essential aspects of the physical layer for FDD mode, which is the dominant mode of operation. Here is useful introduction to practitioners involved in designing LTE based-networks and systems. Part I looks at multiple access techniques and physical layer parameters.
60 GHz groups face off in Beijing over Wi-Fi's future
News & Analysis  
5/18/2010   Post a comment
Engineers appear to have struck a quick compromise in meetings in Beijing this week to hammer out the future of Wi-Fi in the IEEE 802.11ad group that includes members from two opposing camps in 60 GHz wireless technology.
Low-power wireless devices can achieve a reliable wireless link
Design How-To  
5/18/2010   Post a comment
This article examines causes, problems, tradeoffs, and solutions to this ongoing RF-link issue, complete with real-world data
ZigBee PRO network module reduces time to market
Product News  
5/17/2010   Post a comment
Radiocrafts AS has expanded their product line with a compact ZigBee PRO Network Module (ZNM) for use in ZigBee based mesh networks.
Radio module delivers complete custom solution without customer in-house RF
Product News  
5/17/2010   Post a comment
Shortlink's radio module realizes complete custom solution without customer in-house RF or electronics expertise and offers quick time to market
Intersil aims to become $1 billion player
News & Analysis  
5/14/2010   3 comments
Intersil has raised its second quarter outlook.
Product How-To: RF remotes view for IR's crown
News & Analysis  
5/14/2010   Post a comment
The IR remote control is a simple, cost effective method of controlling electronic appliances, but it is also a 30-year-old technology that’s showing its age. RF is a better alternative for modern consumers and the competitors are lining up for the designer’s attention.
Silicon wafer shipments up
News & Analysis  
5/14/2010   Post a comment
Worldwide silicon wafer area shipments increased.
Probe card market looking up
News & Analysis  
5/13/2010   Post a comment
The ATE probe card market is looking up after the downturn in 2009, according to VLSI Research Inc.
Philips replaces 60-W standard bulb with 12-W LED alternative
Product News  
5/13/2010   5 comments
At the Lightfar International tradeshow here, Royal Philips Electronics today unveiled its 12 watt EnduraLED light bulb it claims is the first LED replacement for a 60 watt incandescent light bulb.
Cadence to buy Denali for $315 million
News & Analysis  
5/13/2010   4 comments
EDA software vendor Cadence Design Systems Inc. (San Jose, Calif.) has entered into a definitive merger agreement to buy memory model company Denali Software Inc. (Sunnyvale, Calif.) for $315 million in cash. Denali is expected to have approximately $45 million in cash at closing.
HTC sues Apple over phone, pad and pod
News & Analysis  
5/13/2010   Post a comment
HTC Corp., maker of the so-called Google phone, took legal action against Apple Inc. on Wednesday (May 12), filing a complaint with the International Trade Commission to halt the importation and sale of the iPhone, iPad and iPod in the United States.
A4 processor found inside next-gen Apple iPhone
News & Analysis  
5/12/2010   Post a comment
Apple Inc.'s next generation iPhone will use its new A4 applications processor and support video capture.
Enables ZigBee function integration in smart energy end devices
Product News  
5/12/2010   Post a comment
SyChip has introduced SyNode, a smart energy embedded module dubbed SN3020 that it claims is the smallest, lowest-power, fully compliant ZigBee module supporting Smart Energy and Home Automation profiles.
SyChip rolls low-power smart energy device
Product News  
5/12/2010   Post a comment
SyChip Inc. has introduced SyNode, a smart energy embedded module that it claims is the smallest, lowest-power, fully compliant ZigBee module supporting Smart Energy and Home Automation profiles.
Freescale backs Liquavista for e-reader displays
News & Analysis  
5/12/2010   Post a comment
Electrowetting display provider Liquavista has said it is working with Freescale Semiconductor Inc., a supplier of microprocessors for e-readers.
DuPont claims OLED record fit for TV apps
Research  
5/12/2010   Post a comment
DuPont claims to have achieved record performance in printed organic light emitting diode (OLED) displays.
Design Rivers: Radical innovation
Blog  
5/12/2010   1 comment
A panel of design experts tackles the issue of radical innovation and how to balance innovation against market pressures.
Welcome to the new EETimes Products
Product News  
5/12/2010   Post a comment
EE Times Products: All the details to take your design full circle.
Reactions mixed to home mesh networking effort
News & Analysis  
5/12/2010   1 comment
Reactions to plans to create a mesh standard for home networks have been mixed as backers praise the effort as the future of whole home coverage, competitors from the Zigbee Alliance critique it as a late comer, those with who have worked on other wireless mesh standards indicate it won't be easy -- and some still haven't heard about it.
Arch Rock adds new entry-level PhyNet server
News & Analysis  
5/11/2010   Post a comment
Arch Rock adds new entry-level PhyNet server designed for small or short-term sensor deployments in facilities, data centers, and boasts an Atom processor.
Nikon's fab tool biz down in '09
News & Analysis  
5/11/2010   Post a comment
Nikon Corp.'s fab tool business saw its net sales drop by 31.7 percent from the previous fiscal year to 150.1 billion yen ($1.6 billion).
TSMC approves $1.6 billion capex plan
News & Analysis  
5/11/2010   Post a comment
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. has approved a $1.647 billion capital spending program, including plans to build a new fab in central Taiwan.
First MEMS gyro smartphone to ship in June; it won't be the last
News & Analysis  
5/11/2010   4 comments
Next month's rollout of the first smartphone to pack a MEMS gyroscope is the industry's worst-kept secret. The vendor is a mystery, but the MEMS gyro's rapid adoption by the rest of the field is a certainty.
Welcome to the new EETimes Design site
Design How-To  
5/11/2010   1 comment
EE Times Design: Spot a trend, see the whole picture, start innovating
Wintegra tries again for an IPO
News & Analysis  
5/10/2010   Post a comment
Wintegra Inc. has filed for an initial public offering in the United States--again.
Marvell plans 40-nm ARM server processors
News & Analysis  
5/10/2010   10 comments
Marvell Technology Group Ltd. aims to supply silicon for ARM-based servers with 40-nm multicore processors it will ship this year and is working with multiple partners including one that hopes to port a server version of Microsoft Windows to ARM.
DRAMs are hot, but NAND is not
News & Analysis  
5/10/2010   2 comments
DRAMs are hot. NAND flash is not.
Introduction to High-Speed Digital Design Principles
Design How-To  
5/10/2010   Post a comment
This white paper discusses some of the major factors that need to be considered in designing an embedded product and the various high-speed digital design concepts that play a vital role in the functionality of the hardware/product as a whole.
Guide to Embedded Systems Architecture - Part 4: Application layer networking protocol examples
Design How-To  
5/10/2010   Post a comment
Examples included in this final excerpt from the book "Embedded Systems Architecture: A Comprehensive Guide for Engineers and Programmers" demonstrate networking protocols - FTP, SMTP and HTTP - implemented in both general-purpose and market-specific applications.
Synchronizing NxN MIMO Basestations to an External Timing Reference
Design How-To  
5/10/2010   Post a comment
Understand how a high-performance clock generator, in conjunction with one or more integrated transceivers, simplifies overall design and reduces complexity and cost, while resulting in excellent system receive/transmit performance
WiGig group teams up with SiBeam, Wi-Fi Alliance
News & Analysis  
5/10/2010   1 comment
The Wireless Gigabit Alliance has struck a deal with the Wi-Fi Alliance to have its specification for 60 GHz networking considered as the next generation of Wi-Fi and persuaded a chief competitor, SiBeam Inc., to be the first to deliver silicon for its spec.
Look close to get the big picture
RF & Microwave Designline Blog  
5/7/2010   Post a comment
The twists and turns in M/A-Com's corporate story reflect an industry moving in many directions at once.
Algorithmic delay and synchronization in MPEG audio codecs
Design How-To  
5/5/2010   Post a comment
This article shows the delays of the popular audio codecs and how they're derived, and offers a convenient reference for designs of time-critical systems having a delay budget.
Generalisimo Francisco Franco is still dead - and so is Vinyl
Audio DesignLine Blog  
5/5/2010   1 comment
Music shipment data is out for 2009, and a graph of that data helps put the popularity of the various formats - i.e., digital downloads, CD and vinyl LP - into perspective.
Automotive rear seat entertainment system - Your mobile living room
Design How-To  
5/4/2010   1 comment
Here's a look at tomorrow's multiple in-car entertainment options and how they may be implemented, using STMicroelectronics' STi71xx as an example.
ESC - Renesas and Redpine collaborate on ultra-low-power, high throughput 802.11n Wi-Fi I/O connectivity
News & Analysis  
5/3/2010   Post a comment
Renesas and Redpine have collaborated on ultra-low-power, high throughput 802.11n Wi-Fi I/O connectivity, allowing embedded systems that use Renesas R8C, RX and SuperH MCUs to gain wireless connectivity with Redpine’s Connect-io-n and n-Link 802.11n Wi-Fi modules.
WIRELESS/RF - Synopsys launches industry's first MIPI DigRF v4 IP
Product News  
5/3/2010   Post a comment
Synopsys has launched DesignWare MIPI 4G DigRF Master Controller IP - the industry's first MIPI DigRF v4 IP - and is developing the DesignWare M-PHY, the physical layer for MIPI DigRF v4 interface.
Sony and IPWireless launch joint 4G and beyond wireless initiative
Product News  
5/3/2010   Post a comment
Sony Corporation of America and IPWireless have agreed to jointly research and develop wireless technologies for 4G and beyond, with work beginning immediately on enhancing LTE technology for new applications and services.


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9 comments
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Larry Desjardin

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Larry Desjardin
41 comments
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Karen Field
151 comments
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