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Content tagged with RF/Microwave
posted in May 2014
Regulators May Stymie 60 GHz Use
Blog  
5/28/2014   4 comments
Emerging 60GHz communications could be a prime example of how a market can be held back by subtle differences in government regulations.
Bel Fuse to Buy Emersonís Power Connectivity Unit for $98M
News & Analysis  
5/24/2014   2 comments
Interconnect vendor Bel Fuse Inc. continued to pursue its aggressive acquisition strategy with a $98 million cash deal to acquire the Emerson Network Power Connectivity Solutions (ECS) business of Emerson Inc.
IoT on Display at SolidCon
Slideshow  
5/23/2014   10 comments
In the growing Internet of Things, devices that were once strictly mechanical are now blends of hardware and software -- packages of microcontrollers, sensors, and networked software. The result is a connected world full of possibilities for medical, industrial, and commercial verticals.
Broadcom Rides Bluetooth to IoT
News & Analysis  
5/21/2014   3 comments
Broadcom is shipping new Bluetooth Smart SoCs for its Wireless Internet Connectivity for Embedded Devices developer platform. The company hopes to make integrated Bluetooth, integrated security, and resonant wireless charging a mainstay in the Internet of Things.
Functional Safety Critical for Autonomous Cars
News & Analysis  
5/20/2014   18 comments
Meeting with AEC-Q100 standard isnít enough for chip vendors entering into a future of fully autonomous cars. Ensuring functional safety (ISO 26262) is the critical next step for both software and hardware deployed in cars.
Implant Gets Power Through Flesh
News & Analysis  
5/19/2014   9 comments
A Stanford team claims it has developed a new approach to sending wireless power through living tissue, enabling smaller, deeper implants.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
Maker Faire Meets Silicon Valley
Slideshow  
5/19/2014   11 comments
Many top tech companies came to Maker Faire this year, trying to ride the growing grassroots movement about the joy of design.
Centr Camera, NeoLab Offer New-Look Machine Vision
News & Analysis  
5/16/2014   5 comments
A number of startups are using sophisticated vision capabilities to make small, low cost, low power consumer devices, capable of capturing objects not just in front of you but the surrounding environment as a whole.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Private Equities Cut Ties to NXP
News & Analysis  
5/15/2014   7 comments
Private equity funds, which bought 80.1 percent of NXP Semiconductors in the fall of 2006, are selling off their remaining NXP shares, terminating their control over the Dutch semiconductor company.
Brazil Drives to 4G for World Cup
News & Analysis  
5/14/2014   5 comments
The eyes of soccer fans around the globe will be on Brazil June 12 when at least 3.7 million people descend for the World Cup. A race is on to deploy new networks to ensure the influx of fans will be able to get on the mobile web, but the outcome is still uncertain.
Managing Vehicle Networking
Blog  
5/13/2014   1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Will Goal-Line Technology Change World Cup?
News & Analysis  
5/12/2014   1 comment
The World Cup next month in Brazil represents a momentous advance for the sport, as far as the use of technology is concerned, since FIFA accepted the use of goal-line technology for the first time.
US Event Flexes IoT Muscle
News & Analysis  
5/9/2014   2 comments
Next month's Smart America Summit in Washington, DC, will demo 24 IoT projects supported by more than 100 companies, colleges, and hospitals.
UPnP+ Bridges IoT to Cloud
News & Analysis  
5/8/2014   4 comments
A new set of specs and code from the Universal Plug and Play Forum aims to bridge non-IP devices and cloud services into its WiFi world.
Wearable SoC: Let DSP Do 'Always Listening' Chores
News & Analysis  
5/7/2014   8 comments
To design a wearable SoC, forget about using a multicore app processor. Combining a multifunctional DSP core with a small MCU/CPU is one way to go.
WiGig Is Coming, Test Equipment Close Behind
News & Analysis  
5/5/2014   13 comments
As WiGig moves into production, the major test equipment companies will test it.
Verdict Split in Apple v. Samsung
News & Analysis  
5/2/2014   31 comments
Jurors awarded Apple $119 million, a fraction of the $2+ billion it sought, failing to hurt the Korean company or slow the Android juggernaut.
Wearable Shakeup Ahead, CTO Says
News & Analysis  
5/1/2014   19 comments
Wearables will see a shakeout this year, says the CTO of Lenovo, confirming the computer giant has started a modest chip-design group.


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Max Maxfield

My Mom the Radio Star
Max Maxfield
Post a comment
I've said it before and I'll say it again -- it's a funny old world when you come to think about it. Last Friday lunchtime, for example, I received an email from Tim Levell, the editor for ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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