Icera takes HSDPA lead, says report News & Analysis 6/29/2007 Post a comment Independent research suggests that British wireless technology specialist Icera's HSDPA device and chipset outperform parts from much larger rivals such as Qualcomm and Ericsson Mobile Platforms in terms of data throughput for commercially available devices.
Aeroflex rolls error/noise tester add-ons Product News 6/28/2007 Post a comment Aeroflex has added a G.703 interface pod option to its FB100A bit error rate tester for telecommunications infrastructures. The add-on enables the tester to be used for a wider range of interfaces, ranging from T1 to STM-1 at 155 Mbit/s.
An introduction to UWB over coax technology for HD Design How-To 6/27/2007 Post a comment This document paper provides a brief description of UWB-over-Coax technology (Ultra-wide-Band-over-Coax). It discusses the motivation for and benefits of UWB-over-Coax, its application, and some initial research findings in relation to high definition signals.
SiBeam takes wraps off Wireless HD technology Product News 6/27/2007 Post a comment Gigabit wireless technology startup SiBeam Inc. has revealed some details of the 60GHz technology that it and partners in the WirelessHD consortium plan to deploy to deliver a promised gigabit per second of multimedia content wirelessly in the home.
Global mobile pentration set to pass 50% News & Analysis 6/27/2007 Post a comment There will be 3 billion mobile subscribers by the end of this month, and global mobile penetration is set to exceed 50 percent this year, according to consultancy group The Mobile World (London, England).
Samsung sampling multistandard mobile TV chip Product News 6/27/2007 Post a comment Samsung Electronics Co., Ltd., has started sampling a multi-standard channel decoder and multi-band radio frequency tuner chipset made using its 65-nm process that it says supports almost all mobile TV standards including DVB-H/T, DAB-IP, ISDB-T, and terrestrial DMB.
Open up 900MHz band to 3G, urges GSMA News & Analysis 6/25/2007 Post a comment The widespread deployment of third generation mobile networks in the 900MHz GSM spectrum band, as well as the 2100MHz band, could enable an additional 300 million people across Asia, Europe and Africa to get mobile broadband services by 2012, according to a study by the analyst and consulting company Ovum for the GSM Association.
French startup readies DVB-H IP encapsulator Product News 6/25/2007 Post a comment Seeking to simplify and accelerate the rollout of mobile TV services worldwide, UDcast SA, French provider of IP over broadcast media, has introduced the first DVB-H IP Encapsulator (IPE) with integrated MIP (Megaframe Initialisation Packet) insertion.
RF Design with Operational Amplifiers: Part I Design How-To 6/20/2007 2 comments Want to make the jump to using op amps but just don't have the time to figure out what you need to know? Then today is your lucky day! TI's Bruce Carter steps up with a two-part series to help with an explanation on the key things RF designers need to know about using op amps.
NXP, Andrew partner for satellite LNB Product News 6/19/2007 Post a comment NXP Semiconductors and Andrew Corporation have collaborated on the development of a fully integrated down converter for Ku-band digital video broadcasting satellite Low Noise Blocks (LNB).
MeshNetics opens ZigBee centre in Dresden News & Analysis 6/18/2007 Post a comment ZigBee technology specialist MeshNetics has opened a development and training centre in Dresden, Germany that it says will improve its ability to serve the company's increasing European operations and cut delivery times of its modules and development kits.
GHz-band RF transceiver equipped with SPI-compatible interface Product News 6/14/2007 Post a comment Maxim Integrated Products introduced the MAX2837, a single-chip WiMAX RF transceiver in high-volume production. Designed using a zero-IF architecture, this transceiver requires neither a SAW filter nor extra VCO circuitry, both of which are needed by existing superheterodyne solutions.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.