Freescale hits GaAs on RF basestation ICs Product News 6/30/2010 1 comment Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
transceiver Product News 6/28/2010 1 comment TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
WiMAX group updates mobile standard News & Analysis 6/16/2010 Post a comment Amid threats from a rival standard, the WiMAX Forum has reached a milestone in advancing the speed of data and the efficiency of broadband wireless networks based on the 802.16e Mobile WiMAX standard.
NI PXI brings record and playback capability to car radio Product How-To 6/14/2010 Post a comment A turnkey system that records real-world RF signals, impairments, and environmental data for convenient playback in the lab that was built on the strength of high-bandwidth NI PXI products and building a custom reference library with Averna for long-term test efficiency.
Philips tests home health care devices News & Analysis 6/14/2010 Post a comment Philips Research is exploring the horizon for wearable sensors that measure an increasing number of vital signs to deliver devices that make meaningful predictions about health care while keeping a lid on the devices' power consumption.
ESC Chicago: Machines that Tweet... and some that shouldn't News & Analysis 6/10/2010 Post a comment It started well: Wade Patterson, president and CEO of Synapse Wireless, used his opening remarks at Wednesday’s ESC Chicago keynote address to outline how a wireless embedded network OS has fundamentally changed the game with regard to ubiquitous wireless connectivity, thus enabling 27.6 billion devices to talk to each other, potentially via 140 characters or less a la Twitter. Then reality set in.
Sensors Expo: Powercast demos a prelude to mobile network RF energy harvester News & Analysis 6/9/2010 1 comment After setting up an RF energy-harvesting demo at this week’s Sensors Expo collocated with ESC Chicago, Powercast’s director of marketing Harry Ostaffe presented a paper that outlined the concepts and paths to what he believes to be the endgame: full ambient RF harvesting capabilities that sip power from ubiquitous mobile networks and eliminate batteries and direct RF power sources completely.
Intel invests in Ozmo News & Analysis 6/7/2010 Post a comment Ozmo Devices Inc. (Palo Alto, Calif.), a provider of low-power Wi-Fi personal area network (Wi-Fi PAN) solutions, has completed its series D funding round in the amount of $10.8 million.
RF chips use 10x less power than Bluetooth, Zigbee News & Analysis 6/7/2010 3 comments Europe's Imec research group plans to produce before the end of the year a short range RF transceiver ten times more power efficient than today's Bluetooth and Zigbee chips and demonstrated discrete blocks capable of sending 1,024 Kbytes/second over five meters while consuming less than one milliwatt.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.