Breaking News
Content tagged with RF/Microwave
posted in August 2010
Page 1 / 2   >   >>
Sematech completes 3-D chip pilot line
News & Analysis  
8/31/2010   Post a comment
Sematech announced the completion of its 300-mm, 3-D IC pilot line.
Using requirements planning in embedded systems design: Part 5 - Managing communications between tasks
Design How-To  
8/30/2010   Post a comment
In this six part tutorial, Keith Curtis takes you step by step through development of an embedded systems design requirements document for a seven digit electronic alarm clock. Part 5: Managing communications between tasks
Applied's flowable CVD: Another opinion
News & Analysis  
8/30/2010   Post a comment
Applied called FCVD a ''game changer.'' Some analysts were not as impressed, however.
Analyst cuts forecast for AMD
News & Analysis  
8/30/2010   4 comments
An investment banking firm has lowered its estimates for Advanced Micro Devices Inc.
Report: EMS vendors face supply chain 'pileup'
News & Analysis  
8/30/2010   2 comments
Contract manufacturers are facing a challenging supply imbalance characterized by tight inventories of components and a glut of raw materials, according to a report by market research firm iSuppli.
Intel-Infineon deal: What analysts are saying
News & Analysis  
8/30/2010   8 comments
Here's what analysts said about the Intel-Infineon deal.
Top-of-rack 10GE switches to hit $500M
News & Analysis  
8/30/2010   3 comments
The market for 10 Gbit/second Ethernet switches geared for rack-mounted servers grew a whopping 300 percent in the last quarter, an indicator a major upgrade cycle is underway in business networks, said an analyst.
Chip sales stay strong amid slowdown signs
News & Analysis  
8/30/2010   3 comments
The three-month average of global sales of semiconductors for July was $25.24 billion, up 1.2 percent from June and up 37.0 percent from July 2009, according to the Semiconductor Industry Association.
Microsoft founder sues the industry
News & Analysis  
8/29/2010   17 comments
Interval Licensing LLC, which is backed by Paul Allen, has filed a complaint against AOL, Apple, eBay, Facebook, Google, Netflix, Office Depot, OfficeMax, Staples, Yahoo, and YouTube.
ADI front end ICs aim to lower power consumption
Product News  
8/27/2010   Post a comment
Analog Devices has introduced 12-bit and 10-bit mixed-signal front-ends (MxFEs) that aim to reduce power and board space for developers of wireless infrastructure and portable radio equipment.
Light string has contradictory instructions
8/27/2010   19 comments
What to do when a product's safety labeling contradicts the design itself
Apple should build a fab
8/26/2010   83 comments
With Apple and its key foundry partner, Samsung Electronics, on a collision course in several end-user markets, Apple should consider building its own fab to make the A4 chip for its iPad and iPad.
California proposal could jumpstart U.S. solar market
News & Analysis  
8/26/2010   3 comments
Will solar finally take off in California--and the U.S.?
Analyst: IC business back on track in July
News & Analysis  
8/26/2010   6 comments
After a lull, the IC industry is back on track, at least according to one analyst.
Ford steers electric car push in Portland
News & Analysis  
8/25/2010   13 comments
Ford Motor Co. and Portland General Electric announced a collaboration to help prepare the city of Portland.
Analyst: Street is too bearish on IC climate
News & Analysis  
8/25/2010   1 comment
Regarding the growing chip inventories and IC lull, one analyst drew a simple conclusion: Don't worry.
Applied's flowable CVD: What analysts are saying
News & Analysis  
8/25/2010   Post a comment
Applied called FCVD a ''game changer,'' but analysts were not as impressed.
Fob functionality goes beyond the car
Design How-To  
8/25/2010   10 comments
The latest in RFID and security technologies permit keys to serve as multi-function personal devices—even as credit cards.
VLSI raises IC, fab tool forecasts
News & Analysis  
8/25/2010   1 comment
Despite a lull in the market, VLSI Research Inc. has raised its chip and fab tool forecasts for 2010.
Capacitor lead times could remain stretched through 2010
News & Analysis  
8/25/2010   4 comments
Lead times for aluminum, ceramic and tantalum capacitors could remain abnormally long through the rest of the year, according to iSuppli.
ISuppli: Apple to dominate tablet market through 2012
News & Analysis  
8/25/2010   10 comments
Apple's iPad is set to continue dominating the tablet computer market through at least 2012, accounting for nearly two-thirds of tablet shipments that year, according to iSuppli.
Semico's IC forecast index takes dip
News & Analysis  
8/25/2010   Post a comment
In August, the Semico IPI Index experienced its first drop since December 2009.
SpaceX and the new space race
8/24/2010   5 comments
SpaceX and other commercial vendors deserve a shot at ferrying astronauts and supplies into orbit.
Used fab equipment startup emerges
News & Analysis  
8/24/2010   Post a comment
A group of executives from the ATE and other industries have formally announced a new used equipment and service company.
Renesas assigns patents to Acacia for licensing
News & Analysis  
8/24/2010   3 comments
Chip company Renesas Electronics Corp. has entered into a patent licensing agreement with Acacia Research Corp., a patent portfolio holder and licensor.
Mandating an FM radio in every cell phone: what are they thinking, and why?
8/24/2010   41 comments
Does the proposal to force handsets to include FM radios make any sense, or is it a futile stab at "back to the future"?
Mindspeed 26-core basestation DSP
News & Analysis  
8/23/2010   1 comment
Mindspeed described a new family of SoCs for cellular basestations that use as many as 26 processor cores to compete with a host of vendors including Texas Instruments and Freescale.
Harness speed, performance, signal integrity, and low current advantages of 65nm QDR family SRAMs
Design How-To  
8/23/2010   3 comments
QDR devices based on 65 nm technology provide the ability to achieve high performance and bandwidth with few changes to existing boards in networking applications. Here's how.
Analyst: Applied to roll shallow trench CVD tool
News & Analysis  
8/23/2010   3 comments
Applied this week is expected to roll out a new product-a shallow trench isolation film deposition tool.
PCB layout techniques to maximize power module performance
Design How-To  
8/23/2010   4 comments
Understand how board layout affects results of power subsystems
Handheld spectrum analyzer boasts frequency coverage up to 43 GHz
Product News  
8/20/2010   2 comments
Anritsu’s MS272xC Spectrum Master series provides the broadest frequency range to measure and monitor RF spectrum more effectively than benchtop instruments.
McAfee deal brings Intel into mobile security
News & Analysis  
8/20/2010   10 comments
Intel Corp.'s proposed $7.68 billion acquisition of security software vendor McAfee Inc. expands its ongoing push in the embedded front, especially the mobile space.
ATE shines as fab tool book-to-bill climbs
News & Analysis  
8/20/2010   2 comments
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July, up from 1.18 in June, according to SEMI.
Dongbu opens office in Europe
News & Analysis  
8/20/2010   Post a comment
South Korean foundry vendor Dongbu HiTek has kicked off its strategy to expand its European presence by opening a sales office in Nice, France.
Echelon names president, CEO
News & Analysis  
8/20/2010   Post a comment
Echelon Corp. has appointed Ron Sege as president and chief executive.
Getting LTE device design right
8/19/2010   3 comments
Designing mobile devices for LTE is very different from previous mobile design efforts
Dissecting the requirements document
Design How-To  
8/19/2010   2 comments
In this six part tutorial, Keith Curtis takes you step by step through development of an embedded systems design requirements document for a seven digit electronic alarm clock. Part 1: Dissecting the requirements document.
AMCC buys networking firm
News & Analysis  
8/18/2010   Post a comment
Applied Micro Circuits Corp., now called AppliedMicro, has entered into a definitive stock purchase agreement to acquire Tpack A/S of Copenhagen, Denmark.
Reflections from SanDisk CEO Harari
News & Analysis  
8/18/2010   3 comments
Eli Harari, SanDisk chairman and CEO (shown), gave a keynote and addressed several topics in a keynote address and subsequent interview.
Firm: U.S. falling behind in nanotech
News & Analysis  
8/18/2010   6 comments
The U.S. is also falling behind in the arena, warned a research group.
SanDisk rolls embedded SSD
News & Analysis  
8/18/2010   2 comments
SanDisk Corp. claims to have rolled out the first product in a new category of embedded solid state drives.
Photronics boosts capex again
News & Analysis  
8/18/2010   1 comment
Mask maker Photronics Inc. raised its capital spending again amid strong results.
More states file suits against LCD makers
News & Analysis  
8/17/2010   1 comment
West Virginia Attorney General Darrell McGraw filed suit against manufacturers of thin-film transistor liquid crystal display panels.
Intel tips 'Soda Creek' line of SSDs
News & Analysis  
8/17/2010   5 comments
Intel Corp. is quietly sampling a product line, based on the mini-SATA interface technology.
Dual-mode receive/transmit internal SMD FM antenna module for embedded FM radio applications
Product News  
8/17/2010   Post a comment
Antenova Ltd has announced the addition of the M10385 dual-mode receive/transmit internal surface mount FM Antenna Module for a broad range of mobile and digital media device applications.
Book Excerpt Oscillators - The Darker Side, (Part 1 of 5)
Design How-To  
8/17/2010   1 comment
If you are a fan of Robert Lacoste's 'The Darker Side' column in Circuit Cellular, then you will be happy to know that he has published a book with tips and tricks to help boost your design's performance. Check out this excerpt from the book.
NXP design contest-Building a better Bitchin' Betty
8/17/2010   14 comments
Dave Termohlen has accomplished much in his 25 years as an engineer, but he may just be hitting his stride with Bitchin' Betty.
Price hikes, growth seen in power management ICs
News & Analysis  
8/17/2010   Post a comment
Comprising of ICs and discretes, power management semiconductors are projected to generate sales of $31.4 billion in 2010.
Vanguard Q2 up, says capacity is booked
News & Analysis  
8/16/2010   1 comment
Taiwan specialty foundry vendor Vanguard International Semiconductor Corp. (VISC) reported second-quarter revenue.
NAND specification adds error correction
News & Analysis  
8/16/2010   Post a comment
The Open NAND Flash Interface (ONFI) Working Group has updated its specification to include error correction.
Page 1 / 2   >   >> Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...