Analysis: What's behind Taiwan's decision to ease investment rules? News & Analysis 9/29/2009 Post a comment Comments reported by local media from Taiwan's economic minister Shih Yen-shiang on the easing investment restrictions with regard to mainland China were enough to send the share prices of Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. shooting upwards, but the devil could yet be in the detail.
TSMC, UMC boosted by lifting of Taiwan investment ban News & Analysis 9/29/2009 Post a comment The Taiwan government is set to lift a long-running ban on investment by Taiwanese companies in Chinese counterparts, according to reports. The result is likely to benefit foundry chipmakers Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp.
Eye-Fi uses Secure Digital (SD) card slot for Wi-Fi in cameras Teardown 9/28/2009 Post a comment In a recent product teardown, Portelligent analyzed Eye-Fi's "Share," a Wi-Fi-enabled SD card that makes it easy and affordable to add Wi-Fi connectivity to any digital camera with an SD card slot. Eye-Fi's product line-up includes five Wi-Fi SD card/service combinations between $50 and .
Premier Farnell to offer EDA to get closer to engineers News & Analysis 9/24/2009 Post a comment Component distributor Premier Farnell plc (Leeds, England) wants to become a vendor of PCB layout software, including a free-of-charge lightweight edition. This should allow the company to get closer to engineers and to be able to sell chips direct to them from the design tool as it is in use.
Melexis keeps cutting jobs as it raises guidance News & Analysis 9/23/2009 Post a comment Melexis Microelectronic Integrated Systems NV (Ieper, Belgium), a supplier of automotive ICs and subsystems, has said it now expects 2009 sales to be towards the top of the range given in July, of between 118 million euro (about $175 million) and 123 million euro (about $182 million). Nonetheless the company has announced job cuts at a newly-opened facility in Erfurt, Germany.
AT&T to unleash femtocell for 3G News & Analysis 9/22/2009 1 comment AT&T's long-awaited entry into the femtocells market is believed to rely on home basestations supplied by ip.access (Cambridge, England), powered by silicon from picoChip (Bath, England) and Cisco acting as systems integrator.
Altair offers LTE RF transceiver Product News 9/16/2009 Post a comment Altair Semiconductor Ltd. (Hod Hasharon, Israel), a developer of 4G semiconductors for handheld devices, has announced the availability of its LTE RF transceiver, the FourGee-6150.
Consortium touts crosstalk eliminating DSL technology News & Analysis 9/8/2009 Post a comment Two of the founding members of the iSMART consortium, ECI Telecom and Actelis Networks, said at this week's Broadband World Forum in Paris they have completed the first successful tests of the consortium's Dynamic Spectrum Management Level 3 (DSM L3) technology in conjunction with three major operators.
Austin startup claims first CMOS PA for 3G News & Analysis 9/8/2009 1 comment Fabless semiconductor company Black Sand Technologies Inc. (Austin, Texas) has said it has produced an RF power amplifier for 3G communications in CMOS and claimed it is the world's first.
Dual-band 5 GHz antenna targets Wi-Fi, WiMAX, LTE News & Analysis 9/7/2009 Post a comment Laird Technologies' new antenna system integrates the 2400-2850 MHz and 4900-5850 MHz frequency bands with the company's patented RJ45-ECS field replaceable feed-through Ethernet connector and UV-resistant radomes made of ASA plastic and stainless steel hardware. Additionally, seven antenna connector options are available to adapt to any user's equipment.
Wi-Fi connectivity becoming pervasive News & Analysis 9/7/2009 3 comments Manufacturers launched over 1,000 new Wi-Fi-enabled products in 2008 and 2009 promises to surpass 2008 in new product introductions, according to market research firm In-Stat.
Qualcomm lowers power for body area networks News & Analysis 9/4/2009 Post a comment Qualcomm described a new algorithm to lower the power of body area networks at the EMBC '09 conference, attracting attention from several attendees including representatives of implantable device maker Medtronic.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.