Tesla's Fatal Crash: 6 Unanswered Questions News & Analysis 7/7/2016 42 comments Tesla’s fatal crash has many automotive industry experts wondering what exactly happened. EE Times makes an attempt to dissect which technologies were at play inside Model S Autopilot, and what limitations each technology was manifested in the crash.
19 Views of Sensors Expo Slideshow 6/24/2016 1 comment A walk around the Sensor Expo show floor revealed a widely diverse market of companies, technologies and markets seeking more integrated, lower cost components.
Zero Power Listen-Mode Sensor Debuts News & Analysis 6/22/2016 3 comments An acoustic “event-detection” device like Vesper’s new piezoelectric MEMS microphone uses sound energy to wake a system from full power-down mode, thus enabling battery life of a system embedded with the sensor to span not months but years.
Zigbee Mesh Gets Early Praise News & Analysis 6/15/2016 Post a comment The JupiterMesh wireless network specification from the Zigbee Alliance is getting early praise from analysts as an alternative to Wi-Sun for smart meters and cities.
7 Ways to Skin French Tech News & Analysis 5/31/2016 2 comments France now bills itself as a “startup nation” and is backing its tech industry via a confluence of government money and private sector investment.
17 Views from Imec Tech Forum Slideshow 5/27/2016 5 comments The annual Imec Technology Forum provided insights on the silicon road map including the outlook for EUV and FinFETs as well as an update on the Internet of Things.
Microsoft Shines Light on HoloLens News & Analysis 5/25/2016 2 comments The head of Microsoft’s HoloLens team gave his first public talk on the hardware inside the novel augmented reality headset and the accelerator chip that drives it.
MEMS Broadens Its Horizons Blog 5/17/2016 Post a comment The continued steady growth in the MEMS market overall masks wide variation across the industry’s changing sectors, according to speakers presenting at SEMICON West in July.
IoT's Assumptions Trouble Me Blog 5/5/2016 22 comments Our Silicon Valley bureau chief admits he doesn't want an Apple Watch or Fitbit and has the audacity to suggest that's not his problem, but the industry's.
AMS Wins $77 Million from Intersil News & Analysis 5/5/2016 Post a comment A Texas Judge has ordered power management and analog iC company Intersil Corp. (Milpitas, Calif.) to pay Austria's AMS $77 million in damages, including $10 million in exemplary damages.
Printed Pressure & Temp Sensors Added to Tires News & Analysis 4/5/2016 1 comment Silent Sensors has moved to CPI’s National Printable Electronics Centre in the UK to scale up the London-based company's patented tire sensor technology, which has been developed to measure tire pressure and temperature.
Imaging Revolution: Forget Frames News & Analysis 2/15/2016 7 comments Chronocam has developed an image sensor to capture images not based on frames, but driven by events within view. As imaging shifts to sensing, “Chronocam lies at the forefront of this new wave of innovation,” says an analyst.
19 Views of ISSCC Slideshow 2/5/2016 3 comments Chips for smart cars, fast wired and wireless links, cool cameras and more appeared at at the International Solid State Circuits Conference.
Where Are We With Inattentive Driving? News & Analysis 2/4/2016 16 comments Distracted driving -- especially through the growing use of smartphones in vehicles -- is killing people on the road. Where are the technologies designed to combat the problem of inattentive or intoxicated driving?
Why Opt For Chip Stack, FD-SOI in Image Sensors? News & Analysis 1/28/2016 2 comments Before stampeding to FD-SOI for CMOS image censors (CIS), a few key questions need answering: How big is the CIS market? Why chip stacking in CIS? Why use FD-SOI? We asked Yole Développement to help us break it down.
High-Temperature Electronics Operate at 300°C News & Analysis 1/25/2016 2 comments Sensors and actuators in industrial applications are increasingly deployed in environments with high temperatures. In the joint R&D project HOT 300, five Fraunhofer institutes have developed a number of basic technology components for high-temperature microsystems.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.