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Content tagged with Sensors/Transducers
posted in March 2010
PrimeSense confirms Microsoft 'Natal' design win
News & Analysis  
3/31/2010   Post a comment
PrimeSense Ltd. (Tel Aviv, Israel) a developer of a 3-D recognition sensor technology, has said it is providing the 3-D sensing technology for Project Natal for the Xbox 360 from Microsoft.
Kyocera to acquire LCD facility from Sony
News & Analysis  
3/31/2010   Post a comment
Kyocera Corp. has agreed to acquire a part of Sony Mobile Display Corp.'s thin-film transistor liquid crystal display design and manufacturing business. The amount Kyocera is spending was not disclosed.
Project seeks structures to improve solar cell efficiency
News & Analysis  
3/30/2010   Post a comment
Research organization IMEC (Leuven, Belgium) has started work on a collaborative research project to improve the efficiency and cost of solar cells though the use of metallic nanostructures.
Practical Embedded Security - Part 1: PPP, Ethernet and ARP
Design How-To  
3/29/2010   Post a comment
This week, Part 1 of an excerpt from the book "Practical Embedded Security" looks at low-level communications protocols, including PPP and Ethernet, and their specific security features and requirements.
Intel solar spin-off raises $41.4 million
News & Analysis  
3/26/2010   Post a comment
SpectraWatt Inc. (Hopewell Junction, NY), a manufacturer of photovoltaic cells for the solar industry, has received $41.4 million in investor funding in the form of convertible debt.
Report: India plans wafer fab for LED lighting
News & Analysis  
3/25/2010   Post a comment
De Core Nanosemiconductors Ltd. is planning to spend about 900 crore rupees (about $200 million) building a wafer fab for LEDs in Gandhinagar, Gujurat in the west of India, according to a Business Standard report.
TSMC breaks ground on LED lighting wafer fab
News & Analysis  
3/25/2010   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has held a groundbreaking ceremony for an R&D center and wafer fab to develop and make light emitting diodes for lighting applications.
Chinese fabless firm takes cash for growth
News & Analysis  
3/22/2010   Post a comment
Analog, mixed-signal fabless chip company MaxIC Technology Corp. (Beijing, China) has announced an expansion capital investment led by WI Harper Group.
Understanding Assembly Language for IA-32 and Intel 64 Architectures - Part 1: Basic overview and instruction set extensions
Design How-To  
3/15/2010   Post a comment
Part 1 of a look at understanding assembly language for IA-32 and Intel 64 architectures offers a basic overview of the instruction sets and details on Streaming SIMD Extensions and Advanced Vector Extensions.
Philips, researchers light up clothes with LEDs
Product News  
3/15/2010   6 comments
Philips and several European research institutes have formed an initiative to design LED lighting into a wide variety of consumer products under the so-called PLACE-it program that has won nearly $15 million in funding from the European Commission under its Seventh Framework Program.
Chip firm makes solar cells on RF production kit
News & Analysis  
3/15/2010   Post a comment
RF Micro Devices Inc., a provider of radio frequency integrated circuits for wireless communications applications, has claimed that it has manufactured the industry's first photovoltaic cell using high-volume six-inch gallium arsenide (GaAs) semiconductor production machinery.
Email: Is there still room for startups in WSN?
News & Analysis  
3/12/2010   2 comments
A postgraduate student from Newscastle in the northeast of England writes asking if there is room left for startups to make an impact in wireless sensor networks. If so, he asks that the industry to save a space for him while he finishes his PhD.
Discrete audio amplifier basics - Part 1: Bipolar junction transistor circuits
Design How-To  
3/10/2010   8 comments
Part 1 of an excerpt from the book "Audio Engineering: Know it All" covers the basics of bipolar junction transistors and looks at some typical BJT audio circuit configurations.
Audio codecs, algorithms target the ARM Cortex-M4
Product News  
3/10/2010   Post a comment
Ittiam Systems has announced audio processing software for the ARM Cortex-M4 processor, including a fully optimized implementation of MP3 and WMA decoders, complemented by a set of audio effects and acoustic processing algorithms.
TCP/IP Embedded Internet Applications - The Network Layer, Part 1: The Internet Protocol
Design How-To  
3/8/2010   Post a comment
Part 1 of an excerpt from the book "TCP/IP Embedded Internet Applications" begins with a look at the Internet Protocol, including the IP header, the IP checksum and fragmentation.
Optimizing Embedded Designs for the Intel Atom Processor
Design How-To  
3/8/2010   Post a comment
Designers must understand intricacies involved in hardware, software, and end delivery to select the right Atom-based solution for their embedded devices.
DoE awards $72 loan guarantee for smart windows
Product News  
3/5/2010   1 comment
The Department of Energy awarded a $72 million loan guarantee to Sage Electrochromics to build a smart window that uses electronically controlled inorganic coatings to save energy.
PowerChip plans to make LEDs in China, says report
News & Analysis  
3/5/2010   Post a comment
DRAM maker PowerChip Semiconductor Corp. (Hsinchu, Taiwan) has announced it will open a LED factory in Xuzhou in Jiangsu Province, China, according to a Taiwan Economic News report.
Startup creates PV module production unit at ST Rousset
News & Analysis  
3/4/2010   Post a comment
Startup Nexcis, specializing in the manufacturing of CIGS solar cells and modules from electrodeposition, has inaugurated a photovoltaic (PV) module production unit at STMicroelectronics' former 6-inch fab in Rousset, France.
ESC: Panel to debate wireless sensor networks
News & Analysis  
3/4/2010   4 comments
A panel of experts has been drawn together to discuss the future of wireless sensor networks at the Embedded Systems Conference, which take place April 26 to 29 at the McEnery Convention Center in San Jose, California.
Summit seeks to stimulate deployment of clean energy technologies
News & Analysis  
3/4/2010   Post a comment
A new U.S. energy technology agency is focusing on scaling up and deploying existing clean energy technologies while funding research on disruptive technologies for the future.
NXP in talks on solar cell manufacture at Nijmegen
News & Analysis  
3/1/2010   Post a comment
NXP BV is in talks on the possibility of converting a 6-inch wafer fab at Nijmegen, The Netherlands, to solar cell manufacture. The company does not wish to make solar cells itself but is interested in bringing a partner onto its Nijmegen site, according to CEO Rick Clemmer.


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michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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