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Content tagged with Sensors/Transducers
posted in May 2014
Slideshow: Beyond Google Glass
Slideshow  
5/29/2014   14 comments
A half dozen headset makers demoed devices that aim to leapfrog Google's Project Glass into an emerging 3D augmented-reality market.
IoT on Display at SolidCon
Slideshow  
5/23/2014   10 comments
In the growing Internet of Things, devices that were once strictly mechanical are now blends of hardware and software -- packages of microcontrollers, sensors, and networked software. The result is a connected world full of possibilities for medical, industrial, and commercial verticals.
Connectivity & Sensors: NFC, Humidity, Barometric
Blog  
5/22/2014   1 comment
As the followup to a blog on essential smartphone sensors, Teardown.com talks about what Near Field Communications hardware and barometric and humidity sensors are found in today's smart devices.
Broadcom Rides Bluetooth to IoT
News & Analysis  
5/21/2014   3 comments
Broadcom is shipping new Bluetooth Smart SoCs for its Wireless Internet Connectivity for Embedded Devices developer platform. The company hopes to make integrated Bluetooth, integrated security, and resonant wireless charging a mainstay in the Internet of Things.
Functional Safety Critical for Autonomous Cars
News & Analysis  
5/20/2014   18 comments
Meeting with AEC-Q100 standard isn’t enough for chip vendors entering into a future of fully autonomous cars. Ensuring functional safety (ISO 26262) is the critical next step for both software and hardware deployed in cars.
Implant Gets Power Through Flesh
News & Analysis  
5/19/2014   9 comments
A Stanford team claims it has developed a new approach to sending wireless power through living tissue, enabling smaller, deeper implants.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
Maker Faire Meets Silicon Valley
Slideshow  
5/19/2014   11 comments
Many top tech companies came to Maker Faire this year, trying to ride the growing grassroots movement about the joy of design.
Qualcomm Preps IoT, IBM Upgrades Watson
News & Analysis  
5/16/2014   6 comments
Qualcomm is working on "a portfolio of products" for the Internet of Things, said its new CEO at an event where IBM discussed the future of Watson.
Centr Camera, NeoLab Offer New-Look Machine Vision
News & Analysis  
5/16/2014   5 comments
A number of startups are using sophisticated vision capabilities to make small, low cost, low power consumer devices, capable of capturing objects not just in front of you but the surrounding environment as a whole.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Private Equities Cut Ties to NXP
News & Analysis  
5/15/2014   7 comments
Private equity funds, which bought 80.1 percent of NXP Semiconductors in the fall of 2006, are selling off their remaining NXP shares, terminating their control over the Dutch semiconductor company.
Managing Vehicle Networking
Blog  
5/13/2014   1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Teardown Compares Combo Sensors
Blog  
5/12/2014   3 comments
The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
Will Goal-Line Technology Change World Cup?
News & Analysis  
5/12/2014   1 comment
The World Cup next month in Brazil represents a momentous advance for the sport, as far as the use of technology is concerned, since FIFA accepted the use of goal-line technology for the first time.
Smart Tires: Software Measures Tread Depth
News & Analysis  
5/9/2014   7 comments
A technique that detects if a tire has insufficient tread depth uses software to deduce the actual tread depth from the gradual changes in the tire's rolling behavior over time.
US Event Flexes IoT Muscle
News & Analysis  
5/9/2014   2 comments
Next month's Smart America Summit in Washington, DC, will demo 24 IoT projects supported by more than 100 companies, colleges, and hospitals.
UPnP+ Bridges IoT to Cloud
News & Analysis  
5/8/2014   4 comments
A new set of specs and code from the Universal Plug and Play Forum aims to bridge non-IP devices and cloud services into its WiFi world.
Wearable SoC: Let DSP Do 'Always Listening' Chores
News & Analysis  
5/7/2014   8 comments
To design a wearable SoC, forget about using a multicore app processor. Combining a multifunctional DSP core with a small MCU/CPU is one way to go.
Teledyne Dalsa's CEO Retires
News & Analysis  
5/7/2014   1 comment
Teledyne Dalsa, a pure-play foundry for the manufacture of MEMS, high voltage CMOS, and advanced CCDs, announces retirement of CEO Brian Doody after 29 years with the company.
Microchip Buoyed by SMSC to Record Results
News & Analysis  
5/7/2014   1 comment
Microchip Technology Inc. reported record net sales of $1.931 billion for the three months and fiscal year ending on March 31, 2014. The 22% year-over-year increase points to a winning business strategy based on elbowing-out competitors.
Is There a TEG in Your Power Future?
Blog  
5/7/2014   1 comment
The low-efficiency thermoelectric generator (TEG) finds a role in a camping stove -- but is the energy used/gained balance positive or negative?
Fully Autonomous Car? Don't Buy Shotgun Yet
Blog  
5/6/2014   29 comments
I suspect what’s discussed today as an “autonomous car” is likely to emerge in phases. These cars in each phase will come with fine print stipulating the conditions under which they must be driven.
Do Linear's Dust Networks Matter in IoT?
News & Analysis  
5/5/2014   25 comments
Joy Weiss, president and CEO of Dust Networks at Linear, says that Dust and Cisco co-chair an IETF working group in a bid to include in 6LowPAN some elements of Dust's Time Synchronized Mesh Protocol.


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