Freescale hits GaAs on RF basestation ICs Product News 6/30/2010 1 comment Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
transceiver Product News 6/28/2010 1 comment TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Sensors Expo: Powercast demos a prelude to mobile network RF energy harvester News & Analysis 6/9/2010 1 comment After setting up an RF energy-harvesting demo at this week’s Sensors Expo collocated with ESC Chicago, Powercast’s director of marketing Harry Ostaffe presented a paper that outlined the concepts and paths to what he believes to be the endgame: full ambient RF harvesting capabilities that sip power from ubiquitous mobile networks and eliminate batteries and direct RF power sources completely.
Post mortem reveals 'touchy' user News & Analysis 6/7/2010 1 comment As more multi-touch applications emerge Perceptive Pixel's design decisions for a novel broadcast application should shed some light on using multi-touch in other less mission-critical applications.
Chip processes gesture recognition for innovative HMIs Product News 6/7/2010 Post a comment Gesture recognition is not only a technology for computer games and mobile devices – it increasingly is also an option for innovative automotive human-machine interfaces. Chip maker Elmos AG now has implemented the respective signal processing within one chip.
New sensor aims to be low power electronic nose News & Analysis 6/7/2010 Post a comment Researchers in Europe announced a design for a highly sensitive yet low power vapor sensor that can be tailored to detect a variety of gases for use on wireless networks in applications ranging from health care to the food industry.
Touch is not enough, say display experts News & Analysis 6/2/2010 2 comments Experts in touch technologies assembled at the Society for Information Display conference here explored the future of touch and interactivity for a diverse set of computer and consumer applications.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.