Breaking News
Content tagged with Sensors/Transducers
posted in June 2010
Freescale hits GaAs on RF basestation ICs
Product News  
6/30/2010   1 comment
Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Micron's results: What analysts are saying
News & Analysis  
6/30/2010   Post a comment
Micron Technology Inc. roared past analysts’ consensus estimate in its recent quarter.
Qualcomm brews apps store for mobile OS
News & Analysis  
6/30/2010   Post a comment
Qualcomm Inc. is expanding its efforts in the mobile operating system and connectivity arenas.
Price hikes, shortages seen in hot solar biz
News & Analysis  
6/30/2010   2 comments
Photovoltaic demand is projected to double over last year.
Gyro vendor InvenSense files IPO
News & Analysis  
6/30/2010   Post a comment
InvenSense Inc., a provider of motion processing solutions or gyroscopes, is filing for an IPO.
Mid-range IR sensors feature digital or analog outputs in three package types
Product News  
6/30/2010   Post a comment
Vishay Intertechnology Inc. has beefed up its optoelectronics portfolio with a family of mid-range infrared (IR) sensors featuring digital and analog outputs in three package types.
TruBlue submersible level transducer stores more, lasts longer
Product News  
6/29/2010   Post a comment
Pressure Systems' TruBlue submersible level transducer gets more memory, longer battery life for environmental water usage and water resource applications.
Samsung, TSMC hit by ITC complaint
News & Analysis  
6/28/2010   3 comments
STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
Product News  
6/28/2010   1 comment
TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M
News & Analysis  
6/28/2010   Post a comment
CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses
News & Analysis  
6/28/2010   1 comment
Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi
News & Analysis  
6/28/2010   Post a comment
Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Energy status quo is no longer an option
6/26/2010   3 comments
The energy problem is serious enough to warrant the all-hands-on-deck response; wind, geothermal, solar, bio-thermal and even nuclear technologies all figure into the solution.
IceCube telescope extreme science meets extreme electronics
News & Analysis  
6/25/2010   1 comment
IceCube telescope is under construction more than a mile beneath the Antarctic ice.
Atmel completes sale of fab in France
News & Analysis  
6/24/2010   Post a comment
Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Can Nikon regain its focus?
News & Analysis  
6/24/2010   Post a comment
Can Nikon Corp. regain its focus?
IBM 'fab club' aligns 28-nm process, jabs rival
News & Analysis  
6/24/2010   1 comment
IBM, Samsung, GlobalFoundries and STMicroelectronics said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process.
DRAM makers to pay $173M in price-fixing case
News & Analysis  
6/24/2010   Post a comment
Some 32 states in the United States announced a $173 million settlement with six DRAM manufacturers who "conspired in an illegal global scheme to fix prices."
Group forms another 3-D chip alliance
News & Analysis  
6/23/2010   Post a comment
Another three-dimensional (3-D) chip alliance has been hatched.
Will Spansion succeed or fail again?
News & Analysis  
6/23/2010   Post a comment
Spansion Inc. is looking to make a big comeback.
Intel, FTC in settlement talks
News & Analysis  
6/22/2010   2 comments
The U.S. Federal Trade Commission (FTC) and Intel Corp. have filed a joint motion to ''suspend administrative trial proceedings.''
Chengdu: Spicy city faces hi-tech hurdles
News & Analysis  
6/21/2010   3 comments
Chengdu is fast becoming the next major biotechnology, chip, information technology (IT), LED and renewable energy hub in China.
National Semi buys GTronix
News & Analysis  
6/21/2010   Post a comment
National Semiconductor Corp. has acquired the technology of GTronix Inc.
Trio forms 3-D chip alliance
News & Analysis  
6/21/2010   2 comments
Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Qualcomm invests in optical module company
News & Analysis  
6/16/2010   Post a comment
Mobile phone technology company Qualcomm Inc. has invested in Anteryon International BV, an optics spin-off from Royal Philips Koninklijke NV in 2006.
Interview: Stanford's top engineer from chips to ABCs
News & Analysis  
6/16/2010   12 comments
We sat down recently with James Plummer, dean of Stanford's school of engineering, for a wide ranging interview on the outlook for CMOS, engineering, education and globalization.
Ikaros probe to Venus successfully deploys 'solar sail'
News & Analysis  
6/11/2010   5 comments
Japan's space agency confirmed that a solar sail on its Ikaros planetary probe has been successfully deployed.
Sensors Expo: Powercast demos a prelude to mobile network RF energy harvester
News & Analysis  
6/9/2010   1 comment
After setting up an RF energy-harvesting demo at this week’s Sensors Expo collocated with ESC Chicago, Powercast’s director of marketing Harry Ostaffe presented a paper that outlined the concepts and paths to what he believes to be the endgame: full ambient RF harvesting capabilities that sip power from ubiquitous mobile networks and eliminate batteries and direct RF power sources completely.
Post mortem reveals 'touchy' user
News & Analysis  
6/7/2010   1 comment
As more multi-touch applications emerge Perceptive Pixel's design decisions for a novel broadcast application should shed some light on using multi-touch in other less mission-critical applications.
Chip processes gesture recognition for innovative HMIs
Product News  
6/7/2010   Post a comment
Gesture recognition is not only a technology for computer games and mobile devices – it increasingly is also an option for innovative automotive human-machine interfaces. Chip maker Elmos AG now has implemented the respective signal processing within one chip.
New sensor aims to be low power electronic nose
News & Analysis  
6/7/2010   Post a comment
Researchers in Europe announced a design for a highly sensitive yet low power vapor sensor that can be tailored to detect a variety of gases for use on wireless networks in applications ranging from health care to the food industry.
Touch is not enough, say display experts
News & Analysis  
6/2/2010   2 comments
Experts in touch technologies assembled at the Society for Information Display conference here explored the future of touch and interactivity for a diverse set of computer and consumer applications.
Student Entrepreneur: Gets competitive
6/1/2010   1 comment
Simon Barker, EE Times' resident Student Entrepreneur decides to enter his university's Enterprise Challenge competition. But he leaves it late and burns the midnight oil! Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Like Us on Facebook
Special Video Section
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
Wireless Power enables applications where it is difficult ...
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...