Freescale hits GaAs on RF basestation ICs Product News 6/30/2010 1 comment Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
transceiver Product News 6/28/2010 1 comment TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Sensors Expo: Powercast demos a prelude to mobile network RF energy harvester News & Analysis 6/9/2010 1 comment After setting up an RF energy-harvesting demo at this week’s Sensors Expo collocated with ESC Chicago, Powercast’s director of marketing Harry Ostaffe presented a paper that outlined the concepts and paths to what he believes to be the endgame: full ambient RF harvesting capabilities that sip power from ubiquitous mobile networks and eliminate batteries and direct RF power sources completely.
Post mortem reveals 'touchy' user News & Analysis 6/7/2010 1 comment As more multi-touch applications emerge Perceptive Pixel's design decisions for a novel broadcast application should shed some light on using multi-touch in other less mission-critical applications.
Chip processes gesture recognition for innovative HMIs Product News 6/7/2010 Post a comment Gesture recognition is not only a technology for computer games and mobile devices – it increasingly is also an option for innovative automotive human-machine interfaces. Chip maker Elmos AG now has implemented the respective signal processing within one chip.
New sensor aims to be low power electronic nose News & Analysis 6/7/2010 Post a comment Researchers in Europe announced a design for a highly sensitive yet low power vapor sensor that can be tailored to detect a variety of gases for use on wireless networks in applications ranging from health care to the food industry.
Touch is not enough, say display experts News & Analysis 6/2/2010 2 comments Experts in touch technologies assembled at the Society for Information Display conference here explored the future of touch and interactivity for a diverse set of computer and consumer applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.