GT Solar buys firm News & Analysis 7/30/2010 1 comment GT Solar International Inc., a provider of photovoltaic manufacturing services for the solar industry, has acquired privately-held Crystal Systems Inc.
SiGe Semi files for IPO News & Analysis 7/30/2010 Post a comment RF chip maker SiGe Semiconductor Inc. has filed for an initial public offering of shares of its common stock on NASDAQ under the symbol ''SIGE.''
ASMI buys Siemens' SMT business News & Analysis 7/29/2010 1 comment Germany's Siemens AG will sell its assembly systems business--Siemens Electronics Assembly Systems (SEAS)--to ASM Pacific Technology.
Humidity sensor passes AEC-Q100 automotive standard Product News 7/23/2010 Post a comment Sensirion's new SHT21 humidity and temperature sensor has now been qualified in accordance with the AEC-Q100 automotive standard. This confirms the reliability, stability and robustness of the sensor, which has been in regular production since April 2010.
Losses at ST-Ericsson hit ST's bottom line News & Analysis 7/22/2010 4 comments Despite losses at ST-Ericsson, STMicroelectronics Inc.'s revenues for the second quarter of 2010 totaled $2.531 billion, up 8.9 percent sequentially and up 27 percent year-over-year.
Battle rages on in RTP market News & Analysis 7/22/2010 1 comment When Applied rolled out its next-generation, laser-based anneal system last year, there were fears among competitors that the company would further dominate the rapid thermal processing (RTP) equipment market.
SanDisk CEO Harari to retire News & Analysis 7/22/2010 2 comments In a major surprise, Eli Harari, founder, chairman and chief executive of SanDisk Corp., will retire from his current positions.
Elpida, Spansion ink NAND deal News & Analysis 7/21/2010 1 comment Following its recent move out of bankruptcy, Spansion Inc. posted a drop in sales and announced its long-awaited deal with Japan's Elpida Memory Inc.
VC funding fizzled in June, says GSA News & Analysis 7/21/2010 2 comments June produced a downturn in funding activity for fabless, fabbed and semiconductor equipment companies, both by number of deals and their value, according to the Global Semiconductor Alliance.
Microchip and Cymbet partner on energy-harvesting dev kit Product News 7/20/2010 Post a comment Microchip Technology and Cymbet have partnered to provide the XLP 16-bit Energy Harvesting Development Kit, a customizable energy-harvesting application development kit with a modular development board populated with the PIC24F16KA102 microcontroller—featuring eXtreme Low Power—and the capability to add PICtail daughter boards for the rapid evaluation of a wide variety of system functions, including ZigBee and proprietary wireless connectivity, and SD memory cards.
Atheros buys China firm News & Analysis 7/19/2010 2 comments Atheros Communications Inc. has signed a definitive agreement to acquire Opulan Technologies Corp., a privately-held Chinese fabless semiconductor company.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.