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posted in July 2012
Clemmer: NXP debt under control, focusing on design wins
News & Analysis  
7/27/2012   6 comments
NXP CEO Rick Clemmer (shown) said the chip maker has reduced its debt by $900 million, allowing it to devote more of its resources to key design wins.
HiWave tips glasses frames that provide audio
News & Analysis  
7/26/2012   3 comments
Next generation headsets and glasses frames will be able to deliver audio in a compact way without using ear buds or sticking things in the ear canal, according to HiWave.
Honeywell SMART Position Sensor boasts 360° non-contact position sensing
Product News  
7/25/2012   Post a comment
Honeywell's new SMART position sensor provides 360° non-contact angular position sensing.
Smart proximity sensor distinguishes between human body and inert objects
Product News  
7/25/2012   Post a comment
The SX9300 from Semtech Corporation is an ultra-low power capacitive proximity sensor with on-chip Specific Absorption Rate (SAR) engine for human body detection.
Expert, lawmakers at odds over GPS security
News & Analysis  
7/25/2012   9 comments
After testifying before Congress about security vulnerabilities in civil GPS systems last week, Todd Humphreys is convinced the industry needs a new approach.
RS Components signs global distribution agreement for HiWave Technologies audio and haptic devices
News & Analysis  
7/25/2012   Post a comment
HiWave Technologies and RS Components have announced a worldwide distribution agreement whereby RS will stock HiWave's range of audio exciters, haptic touch feedback actuators, balanced mode radiator (BMR) speaker drivers and energy efficient amplifier modules.
Sensor Platforms extends library to mobile apps
News & Analysis  
7/21/2012   Post a comment
Sensor Platforms has announced its FreeMotion library of software algorithms and middleware now supports all major mobile microprocessors, in addition to previously announced support for all sensors used in smartphones and tablets.
6-axis MEMS chip gets motion engine
News & Analysis  
7/17/2012   3 comments
STMicroelectronics has shrunk its 6-axis accelerometer-gyroscope combo chip while adding a smart motion processing chip.
Maxim sensor strategy targets analog integration
News & Analysis  
7/16/2012   3 comments
Maxim Integrated Products is attempting to take analog integration to a new level by combining up to seven sensors in a tiny optical package.
Honeywell tailors board-mount pressure sensors for medical apps
Product News  
7/11/2012   Post a comment
These high-resolution sensors are aimed at customers who want to do their own compensation, calibration, and amplification to make use of the maximum resolution of the bare sensor output.
Thin Film printed electronics selected for smart packaging
News & Analysis  
7/11/2012   6 comments
Bemis Company Inc. (Neenah, Wisc.), a producer of films and packaging for the food and healthcare industries, is working with printed electronics pioneer Thin Film Electronics ASA (Oslo, Norway) to develop a flexible sensing film that can wirelessly communicate data.
One in every five wearable wireless devices set for healthcare deployment by 2017
7/8/2012   1 comment
A new wave of wearable devices is being launched that will help track and share data from a range of activities and conditions, taking a large share of the wearable wireless devices market, according to ABI Research.
World's first Bluetooth low energy bike speed and cadence monitor is released
News & Analysis  
7/8/2012   Post a comment
Specialist smartphone fitness company, Wahoo Fitness, is launching the world's first Bluetooth low energy bike speed and cadence monitor - the Wahoo Blue SC - that employs a Nordic Semiconductor's µBlue nRF8001 Connectivity chip that tracks a bike's lifetime mileage.
Search engine aims to quiz sensor networks
7/8/2012   3 comments
A new type of search engine is being developed that can interrogate networks of sensors to give real time answers to questions about the physical world.
Tools expand for sensor fusion hubs
News & Analysis  
7/6/2012   1 comment
An expanding suite of tools for fusing the outputs from MEMS chips is designed to enable designers to develop sensor fusion algorithms.
MilAero Top 10 'How To' articles in first half
Design How-To  
7/6/2012   Post a comment
Here is the list of the Top 10 How-To Design Articles posted on Military Aerospace Designline in the first half of 2012, as determined by your page views.
Advanced switches customize, optimize automotive HMIs
Design How-To  
7/6/2012   Post a comment
Known in the industry as “haptics,” the touch, feel, and sound of a switch’s actuation are paramount to a user’s experience and impression of a particular vehicle. Automotive design engineers want user interfaces to respond and provide feedback in specific ways that are unique to their vehicle.
IMS2012: Show in review
Design How-To  
7/3/2012   Post a comment
Here's a wrap-up of some of the things I saw at the IMS2012 in Montreal June 19-21st, 2012.
Embedded vision: FPGAs’ next technology opportunity
Design How-To  
7/2/2012   3 comments
This article addresses the emerging application of embedded vision moving into multiple applications, including military and aerospace.

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Max Maxfield

Teensy-Weensy GPAK4 Mixed Signal FPGAs
Max Maxfield
Post a comment
The vast majority of the embedded designers I know typically create MCU-based systems -- they rarely even consider using a Field-Programmable Gate Array (FPGA).

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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