China's SMIC Responds to Soaring 3D IC Market News & Analysis 10/21/2013 5 comments To capture the rapidly growing thru-silicon-via technology-based stacked device market, China Semiconductor Manufacturing International Corp. has formed an R&D and manufacturing center dedicated to 3D IC.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.