Huawei to use Agere processors News & Analysis 11/15/2005 Post a comment Huawei Technologies will use Agere Systems Inc.’s Advanced Payload Plus 300 network and Link Layer processors in its next-generation 3G infrastructure equipment.
Report forecasts convergence renaissance News & Analysis 11/9/2005 Post a comment A report from consulting firm Deloitte predicts the convergence industry will total more than $1 trillion by 2010, led by such services as voice-over-IP, with industry analysts forecasting $1 trillion in revenue by 2010.
STATS ChipPAC opens wafer bump plant in China News & Analysis 11/3/2005 Post a comment Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.
Delphi to close plants, says report News & Analysis 11/2/2005 Post a comment Troubled auto parts maker Delphi Corp. is studying a plan to remake its Electronics & Safety division by shedding U.S. factories, shutting technical centers and possibly buying rival Motorola's automotive unit, according to a Reuters report quoting the Detroit News.
Renesas to license SMSC's IP for digital content News & Analysis 11/2/2005 Post a comment SMSC and Renesas Technology Corp. have reached a licensing agreement enabling Renesas to incorporate SMSC technology providing Digital Transmission Content Protection (DTCP) for DVD audio and video, including copy-protected DVDs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.