Tensilica aims at Chinese audio News & Analysis 4/24/2012 2 comments Tensilica is banking its future growth on the world's largest electronics market by adding support for China's Dynamic Resolution Adaptation standard to its entire library of over 100 audio encoders, decoders, an sound enhancement chips for adding high-fidelity audio digital signal processors to mobile handsets.
Huawei recognizes Lattice as 'core partner' News & Analysis 4/18/2012 Post a comment Huawei Technologies Co. Ltd., one of the world's largest suppliers of telecommunications and networking equipment, has recognized FPGA vendor Lattice Semiconductor Corp. (Hillsboro, Ore.) as a "2011 Core Partner."
Arbitrator orders ST Micro to pay NXP $59M News & Analysis 4/9/2012 4 comments STMicroelectronics has been ordered to pay about $59 million to NXP Semiconductors by an arbitration tribunal to settle a dispute over charges for wafers NXP supplied to ST's wireless joint venture in 2008 and 2009, ST said.
EDA/IP Weekly Roundup – Apr 4th Blog 4/4/2012 Post a comment Dialog, TSMC, Open-Silicon, Analog Bits, Gartner, ABI, Synopsys, Analog Devices, Kilopass, CEVA, OCP-IP, NXP and MarketsandMarkets made the lineup today. See here for their news…
Can the cloud revive manufacturing? News & Analysis 4/3/2012 22 comments A new study argues that information technology in the form of "cloud-enhanced services" is one way western manufacturers can add value to products and compete with Asian manufacturing giants.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.