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posted in June 2010
Freescale hits GaAs on RF basestation ICs
Product News  
6/30/2010   1 comment
Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Micron's results: What analysts are saying
News & Analysis  
6/30/2010   Post a comment
Micron Technology Inc. roared past analysts’ consensus estimate in its recent quarter.
Qualcomm brews apps store for mobile OS
News & Analysis  
6/30/2010   Post a comment
Qualcomm Inc. is expanding its efforts in the mobile operating system and connectivity arenas.
Price hikes, shortages seen in hot solar biz
News & Analysis  
6/30/2010   2 comments
Photovoltaic demand is projected to double over last year.
Gyro vendor InvenSense files IPO
News & Analysis  
6/30/2010   Post a comment
InvenSense Inc., a provider of motion processing solutions or gyroscopes, is filing for an IPO.
Intel, Israel discuss next fab, says report
News & Analysis  
6/29/2010   Post a comment
Intel is discussing locating a wafer fab in Kiryat Gat, Israel, with the Ministry of Industry, Trade and Labor, according to The Media Line.
TSMC given OK to take 10% SMIC stake
News & Analysis  
6/29/2010   Post a comment
The Taiwanese Ministry of Economic Affairs has approved an application by TSMC to take up a 10 percent stake in Chinese foundry rival SMIC, according to reports.
Samsung, TSMC hit by ITC complaint
News & Analysis  
6/28/2010   3 comments
STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
CoorsTek buys ceramics unit for $245M
News & Analysis  
6/28/2010   Post a comment
CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses
News & Analysis  
6/28/2010   1 comment
Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi
News & Analysis  
6/28/2010   Post a comment
Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Russia's Sistema still pursuing Infineon, says report
News & Analysis  
6/28/2010   Post a comment
Infineon has denied it is in discussions with diversified Russian holding company AFK Sistema, according to a report, in a rerun of denials from September 2009 and earlier. Another report has said that Sistema
Atmel completes sale of fab in France
News & Analysis  
6/24/2010   Post a comment
Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Can Nikon regain its focus?
News & Analysis  
6/24/2010   Post a comment
Can Nikon Corp. regain its focus?
IBM 'fab club' aligns 28-nm process, jabs rival
News & Analysis  
6/24/2010   1 comment
IBM, Samsung, GlobalFoundries and STMicroelectronics said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process.
DRAM makers to pay $173M in price-fixing case
News & Analysis  
6/24/2010   Post a comment
Some 32 states in the United States announced a $173 million settlement with six DRAM manufacturers who "conspired in an illegal global scheme to fix prices."
Group forms another 3-D chip alliance
News & Analysis  
6/23/2010   Post a comment
Another three-dimensional (3-D) chip alliance has been hatched.
VLSI ups fab tool outlook in hot market
News & Analysis  
6/23/2010   Post a comment
The fab tool and materials industries are hot.
Will Spansion succeed or fail again?
News & Analysis  
6/23/2010   Post a comment
Spansion Inc. is looking to make a big comeback.
Intel, FTC in settlement talks
News & Analysis  
6/22/2010   2 comments
The U.S. Federal Trade Commission (FTC) and Intel Corp. have filed a joint motion to ''suspend administrative trial proceedings.''
Chengdu: Spicy city faces hi-tech hurdles
News & Analysis  
6/21/2010   3 comments
Chengdu is fast becoming the next major biotechnology, chip, information technology (IT), LED and renewable energy hub in China.
National Semi buys GTronix
News & Analysis  
6/21/2010   Post a comment
National Semiconductor Corp. has acquired the technology of GTronix Inc.
Trio forms 3-D chip alliance
News & Analysis  
6/21/2010   2 comments
Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Interview: Stanford's top engineer from chips to ABCs
News & Analysis  
6/16/2010   12 comments
We sat down recently with James Plummer, dean of Stanford's school of engineering, for a wide ranging interview on the outlook for CMOS, engineering, education and globalization.
Indian broadband auctions fetch $8.5 billion
News & Analysis  
6/11/2010   Post a comment
Only one nation-wide carrier emerged from India's broadband wireless auctions.
Achieve robust designs with Six Sigma--Part II
Design How-To  
6/8/2010   Post a comment
Customers want reliability, efficiency, flexibility, and affordability. To deliver products, this robust, quality manufacturing isn't enough. Here's a complete blueprint for implementing Six Sigma product design including such proven techniques as Voice-of-Customer (VOC) and Critical-to-Quality (CTQ) to Kano modeling. See how Six Sigma bridges critical gaps between R&D, product and process.
Opinion: Western OEMs must end their complicity in exploiting Chinese workers
6/1/2010   21 comments
It’s wrong for Apple and other global OEMs to continue, wittingly or unwittingly, to prop up China’s exploitation of its workers. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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