Embedded Systems Conference
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posted in June 2012
Legislation seeks to relax restrictions on tracking fake chips
News & Analysis  
6/28/2012   12 comments
A House proposal seeks to reverse U.S. customs rules that prevent chip makers from examining fake chips to determine their authenticity. However, the bill is a long way from final passage.
China speed vs. China quality
Blog  
6/27/2012   30 comments
Many of my friends, colleagues and readers told me that a flood of comments posted by EE Times community members’ after each of my China stories is more revealing than my reporting.
U.S., European manufacturers join forces to compete with China
News & Analysis  
6/27/2012   56 comments
U.S. and European EMS providers are beginning to join forces as one way to compete with China's electronics manufacturing juggernaut.
Avnet: China Fabless Sector Needs Stimulus, Education
News & Analysis  
6/27/2012   Post a comment
China’s exports are in the midst of a short term slump, and longer term its chip makers need education on how to use global distribution, according to Avnet China's Frederick Fu.
Experiencing the Chinese supply chain, up close and personal
Blog  
6/18/2012   3 comments
It's buyer beware when shopping for electronics in Shenzhen's Huaqiangbei district.
Silicon Valley Bank gears up China venture
News & Analysis  
6/14/2012   2 comments
Taking its expertise with chip startups to the mainland, Silicon Valley Bank aims to be the first U.S. tech-focused bank operating in China by September.
Slideshow: The last Computex?
News & Analysis  
6/7/2012   4 comments
The Computex exhibit was bustling, but like most exhibitions that compete with the Internet to show the latest gizmos, most of the action at this show remains in the hotel suites where the deals get done.
European report considers 450-mm More-than-Moore fab
News & Analysis  
6/6/2012   6 comments
A report prepared for the European Commission just published discusses the potential role of European authorities in encouraging the creation of both a pilot 450-mm wafer fab to support Europe's chip equipment companies and a volume manufacturing 450-mm plant for a variety of More-than-Moore processes.
Indian gov't hires Accenture to review fab proposals
News & Analysis  
6/6/2012   6 comments
Accenture said it has been selected by India's Department of Electronics & Information Technology to review investment proposals from global technology providers and investors interested in building semiconductor fabs in India.
Four reasons why its 'game over' for foreign chip firms in China
News & Analysis  
6/6/2012   180 comments
Multinational semiconductor companies are no longer able to compete with Chinese fabless chips vendors in the consumer electronics IC business, according to Vincent Tai (shown), CEO of RDA Microelectronics.
Indian expat engineers bring medtech back home
India Chip Chat  
6/4/2012   4 comments
After training and working abroad, medtech entrepreneurs are coming back to India with health care solutions to serve the Indian market, especially the country’s poor.
U.S. tariffs on Chinese solar panels could slow industry
News & Analysis  
6/4/2012   7 comments
U.S. tariffs on Chinese solar panels could end up harming the entire solar market.


Radio
LATEST ARCHIVED BROADCAST
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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