China speed vs. China quality Blog 6/27/2012 30 comments Many of my friends, colleagues and readers told me that a flood of comments posted by EE Times community members’ after each of my China stories is more revealing than my reporting.
Slideshow: The last Computex? News & Analysis 6/7/2012 4 comments The Computex exhibit was bustling, but like most exhibitions that compete with the Internet to show the latest gizmos, most of the action at this show remains in the hotel suites where the deals get done.
European report considers 450-mm More-than-Moore fab News & Analysis 6/6/2012 6 comments A report prepared for the European Commission just published discusses the potential role of European authorities in encouraging the creation of both a pilot 450-mm wafer fab to support Europe's chip equipment companies and a volume manufacturing 450-mm plant for a variety of More-than-Moore processes.
Indian gov't hires Accenture to review fab proposals News & Analysis 6/6/2012 6 comments Accenture said it has been selected by India's Department of Electronics & Information Technology to review investment proposals from global technology providers and investors interested in building semiconductor fabs in India.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.