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Qualcomm to Leverage Monolithic 3D for Smartphones

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resistion
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Re: Second FEOL
resistion   4/18/2015 9:00:21 PM
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Also, the figure suggests adding layers of similar density, it suggests that advanced node costs are multiplied by number of layers, including FEOL and BEOL.

bec0
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Re: Second FEOL
bec0   4/18/2015 8:50:52 PM
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That's been the rub for decades...how to make a perfectly aligned FEOL on top of a BEOL, without hurting the BEOL. CEALeti's 3DV seems to be using short wavelength lasers & post-transfer solid phase epitaxial regrow for the FEOL above, and tungsten BEOL below to overcome this. Others, such as Monolithic 3D Inc., have proposed other ways to get around the challenge, and maintain an Al/Cu BEOL below. Looks like the time to shift to monolithic 3d approaches is now...Qualcomm is now the driver, everybody else needs to keep pace.

Zeev00
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Today's front-page Wall Street Journal
Zeev00   4/18/2015 5:34:59 PM
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"Some big computer users are going beyond such chips to try other new designs, since smaller transistors alone aren't boosting computing speeds enough.

"Moore's Law is not having the same effect on the rate of gains we are seeing," said Gordon MacKean, a senior director of Google Inc.'s hardware platforms team.

Some makers of data-storage chips are taking more dramatic steps. Producers of chips called NAND flash memory used in smartphones and an increasing number of computers have decided to stop shrinking transistors, worried that smaller circuitry won't store data reliably.

Instead, they plan to stack circuits in three dimensions—32 or 48 layers per chip—rather than on a flat square of silicon to keep boosting the capacity of their devices."

http://www.wsj.com/articles/moores-law-runs-out-of-gas-1429282819

When it makes the front page of WSJ ... :-)

resistion
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No TSV
resistion   4/18/2015 1:01:04 PM
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It's significant that Qualcomm has not endorsed TSVs for smartphones: http://www.eetimes.com/document.asp?doc_id=1326174&

resistion
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Re: Samsung the leader
resistion   4/18/2015 12:23:54 PM
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So Samsung is the expected sole provider for Qualcomm's 3DV?

resistion
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Second FEOL
resistion   4/18/2015 12:22:38 PM
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A second FEOL seem detrimental to the first wafer's BEOL.

alex_m1
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Re: in the 8 billion dollar smart phone market
alex_m1   4/18/2015 11:11:58 AM
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Or_bach, Thanks.

 

Or_Bach
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Re: in the 8 billion dollar smart phone market
Or_Bach   4/18/2015 10:18:33 AM
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Hi Alex

Good question 

Unlike memory it takes time to architect and design higher complexty circuit using more gates. So keeping the historic rate could be a good guess.

Yet, adding massive amount of memory would be easier in 3D IC so may be we would see some acceleration.

So the short answer - I don't know 

alex_m1
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Re: in the 8 billion dollar smart phone market
alex_m1   4/18/2015 8:03:03 AM
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Or_bach, with 3d logic, will there be a need to add a layer each node, or do you think we'll see companies adding massive amounts of layers like thhey do in 3d NAND ?

bec0
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Re: Samsung the leader
bec0   4/18/2015 12:29:14 AM
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Qualcomm says 2016 for logic SoC production.Maybe they are utilizing their current relationships with Chinese fabs. It will indeed be interesting to see if Samsung beats them to the punch in logic. S seems to be a bit more focused on monolithic 3D NAND so far.

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