This is way cool. At the private funded stage, Liquid-Cooled Embedded Computing (LCEC) is an initiative that will most likely soon work its way to a standard. One of the biggest problems around is to deal with the tendency in silicon to get smaller while the current method of handling thernal issues, with air, requires a lot of space.
I met with John Peters, acting chairman of the initiative, at GlobalComm today and his take is that the eventual standard will enable architectures that result in 500% better compute density potential than any existing standard. The standard is expected to, because of its small size, enable a fine-grained architecture that minimizes the need for a variety of form factor sizes across a wide-range of applications.
Peters claims that the reduction of module depth will enable 300mm and 600mm telecommunications environments to be supported. Provisioning for front and rear panel I/O options will also be featured.
Stay tuned this summer—we’ll be hearing a lot more.