There are often many news items that are not worth writing a full blog about, but may still be of interest to people. This is a roundup of those items...
This is a roundup of news or activities in the past few days that may be of interest to people.
Fujitsu Semiconductor Europe and Mentor Graphics Corporation have announced that Fujitsu has chosen the Mentor® Embedded Sourcery CodeBench for ARM® EABI (embedded application binary interface) to support Fujitsu's FM3 Cortex™-M3 microcontrollers and hardware evaluation boards. "Mentor's Sourcery CodeBench is the de-facto standard GNU toolchain for a broad range of hardware architectures," said Wolf Fronauer, marketing manager, Fujitsu Semiconductor Europe. "Our mission was to create an embedded ecosystem for both bare metal and OS development, enabling our customers to compile, debug, and test with greater reliability and speed."
Synopsys announced that its DesignWare® SuperSpeed USB 3.0 IP has surpassed 40 SoC design wins and more than 30 customer licensees worldwide. Because Synopsys' DesignWare USB 3.0 Digital Core and PHY IP has been broadly adopted by leading semiconductor companies targeting a variety of applications and process technologies, designers can be confident the IP is silicon-proven and can lower their SoC integration risk.
Arasan Chip Systems has announced that the company added an ONFI 3.0 PHY to its Flash Storage solution. Arasan's existing ONFI 3.0 NAND Flash Controller with patent pending dynamically configurable ECC technology seamlessly integrates with the new PHY to form an easy to use, high-performance Flash Storage solution. As the NAND Flash landscape is changing, Arasan NAND Flash Controller IP Core is changing with it. The increasing demand for NAND flash with higher data transfer rates and better data integrity has led to the creation of the ONFI 3.0 NAND flash specification supporting 400MT/sec.
Rudolph Technologies, a provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) based processes for advanced 3D IC integration. In addition to speed and accuracy, the systems’ flexibility to handle a wide range of applications was a key factor in the selection.
Kilopass Technology Inc., a provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), has announced that its XPM IP is integrated into a Haier Set Top Box (STB) decoder SoC. Configuration data for mixed signal components are programmed in Kilopass XPM IP for each Haier SoC during final test and can be reprogrammed once installed to accommodate wear in the mixed signal components over time.
Cadence Design Systems has announced that X-FAB, a foundry group for analog/mixed-signal semiconductor applications, has qualified the Cadence® Physical Verification System for the majority of its process technologies. Foundry qualification means that X-FAB has given its stamp of approval for silicon accuracy of the Cadence Physical Verification System across all of its process nodes, and that mixed-signal customers can reap new performance and productivity advantages enabled by its tight integration into the Cadence Virtuoso® and Encounter® flows.
Alvand Technologies an analog and mixed signal IP provider, today announced that it will be offering Analog Front End (AFE) IP for wireless (MIMO) applications in GLOBALFOUNDRIES' 28nm foundry process. This integrated Wireless MIMO AFE IP includes two 12-bit ADC cores, two 12-bit DAC cores, one 10-bit auxiliary ADC, one 10-bit auxiliary DAC and a low-jitter PLL. The IP is designed for extremely low-power operation for companies developing next-generation devices for high-volume wireless applications.
Brian Bailey – keeping you covered
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