MEMS has come a long way from those tiny switches, and today STMicroelectronics says MEMS and TSV can be used together for even higher densities...
Is it technology or art? It is most certainly amazing and I have to admit that I had no idea that MEMS (Micro-Electro-Mechanical Systems) had progressed quite so far. I was still imagining small accelerometers or switches. Then I received a press release from STMicroelectronics this morning and I went to look for a suitable picture to add to the blog. I became totally caught up in looking at the images. Amazing – gears, clutches, motors. These are complete mechanical systems. I bet they could even build a watch. It appears as if I am 5 years behind the times on this. ST says they have now shipped more than 1.6 billion MEMS chips, addressing applications in consumer, computer, automotive, industrial and medical segments.
So anyway, back to the press release. It seems as if STMicroelectronics has claimed another first. This time they have combined MEMS with TSV (Through Silicon Vias) for full production capacities. TSV replaces traditional wiring with short vertical interconnects in multi-chip MEMS devices, such as smart sensors and multi-axis inertial modules, enabling a higher level of functional integration and performance in a smaller form factor.
TSV utilizes short, vertical structures to connect multiple silicon dice stacked vertically in a single package, offering greater space efficiency and higher interconnect density compared with wire bonding or flip chip stacking. Already deployed in volume production, the ST-patented TSV technology helps shrink the MEMS chip size while increasing its robustness and performance. "There is a great demand for smaller packages in the consumer market. ST's breakthrough implementation of TSV in MEMS devices opens a path to reduced footprints and increased functionality in mobile phones and other gadgets,"
said Benedetto Vigna, Corporate Vice President and General Manager of ST's Analog, MEMS and Sensor Group. "High-performance 3D-chip integration in our smart sensors and multi-axis inertial modules marks another important milestone in our mission to make MEMS ubiquitous in all facets of life."
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