There are often many news items that are not worth writing a full blog about, but may still be of interest to people. This is a roundup of those items...
This is a roundup of news or activities in the past few days that may be of interest to people.
Magma has announced that Diodes has used FineSim(TM) SPICE multi-CPU circuit simulation technology to tape out two integrated synchronous switching voltage regulators. The AP6502 and AP6503, 340 kHz switching frequency external compensated synchronous DC/DC buck converters, are designed for use in consumer electronics systems such as digital TVs, LCD monitors and set-top boxes, which require ultra-efficient voltage conversion. Utilizing FineSim SPICE multi-CPU simulation technology, Diodes Incorporated significantly reduced simulation runtime, enabling them to increase simulation coverage by 3X to 4X without sacrificing accuracy.
Mentor is getting deeper into the automotive segment, this time teaming up with Freescale Semiconductor to accelerate in-vehicle infotainment product development for the i.MX6 Series of Applications Processors. The Mentor Embedded Linux In-Vehicle Infotainment (IVI) Base Platform is registered compliant with the requirements of the GENIVI Alliance, an automotive and consumer electronics industry association that drives collaboration among automotive OEMs and software developers, to build open source infrastructure for IVI systems. The Freescale i.MX6 multicore processors combine high performance, 3D graphics, high-definition video capabilities, and aggressive power management capabilities, making them ideal for use in developing multimedia applications, including next-generation IVI systems. Integrating one, two or four ARM® Cortex™-A9 cores, i.MX6 processors are further distinguished by optimal scalability, featuring software, pin and tools compatibility across family members.
Freescale recently entered production with the latest device in their Kinetis™ family of Systems-on-Chip (SoC), designed by the Freescale Microcontroller Solutions Group (MSG). The Kinetis design features the latest low power design techniques in a complex architecture with over 20 power domains and over 50 clocks. The chip was successfully designed, implemented and verified using the Cadence Low-Power Solution.
United Microelectronics Corporation and Synopsys have announced an expanded collaboration to develop DesignWare® IP for UMC's 28-nanometer (nm) HLP Poly SiON process. Extending its previous successes in UMC's 40-nm and 55-nm processes, Synopsys plans to implement its proven DesignWare Embedded Memories and Logic Libraries in UMC's 28HLP Poly SiON process technology. This collaboration will enable designers to create high-speed, low-power system-on-chips (SoCs) with less risk and improved time-to-market. The longstanding relationship between the two companies extends the availability of high-quality DesignWare IP for a wide range of UMC processes from 180-nm to 28-nm.
Imperas™ has announced that they are cooperating with Renesas Electronics Corporation on the verification of the Open Virtual Platforms™ (OVP™) Fast Processor Models of the Renesas V850 cores. These models are being used with the OVPsim™ virtual platform simulator, usually for software testing of automotive electronics applications. Users include NIRA Dynamics, a provider of tire pressure sensor systems. “In the automotive electronics industry we always need to do more testing of our embedded systems software,” said Peter Lindskog, head of development for NIRA Dynamics AB, a subsidiary of Audi Electronics Venture GmbH. “Finding that the simulation performance of the Imperas/OVP V850 model was 50 times faster than our previous solution opens up new possibilities for us in software testing, and enables us to increase our test coverage and product reliability."
Brian Bailey – keeping you covered
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