This is a roundup of news or activities in the past few days that may be of interest to people.
Elliptic Technologies has announced the release of its IPsec Security Protocol Processor, SPP-230, to address the security needs of the 4G LTE mobile backhaul networks. This security engine accelerates IPsec packet processing to allow for multi Gbps performance by providing complete IPv6 ESP and AH packet transforms support. In order to address the growing mobile data traffic and to lower the cost, operators will continue to transition to 4G networks and adopt IP/Ethernet secured by the IPsec protocol as the mobile backhaul solution. Elliptic’s SPP-230 ESP/AH PDU Processor meets the security requirements for wireless backhaul encryption over IP/Ethernet networks with features including scatter-gather DMA, QoS for enhanced traffic management support and virtualization designed to allow sharing between multiple CPUs. The engine is targeted at SoC suppliers for mobile base stations, cell site routers and gateways.
Altium has announced the addition of a new range of board-level components from STMicroelectronics' Power Management catalogue to its online content delivery ecosystem, AltiumLive. Along with device manufacturers such as STMicroelectronics, Altium has also established relationships with parts suppliers and vendors such as Newark, Digi-Key and Mouser. This allows board-level components to include real-time supply-chain information, such as vendor choice, pricing and availability.
Tessera Technologies announced its results for the fourth quarter and full year ended Dec. 31, 2011. 2011 was a year of change for the Company. They made major changes to the executive team and board of directors, including a new CEO, new chairman of the board, and two new board members. They renewed two of their key DRAM licenses in the fourth quarter. They state that their MEMS technology has met and exceeds the performance and reliability requirements based on test criteria from multiple Tier 1 mobile phone makers. The MEMS actuator is now on track for a crucial design win in the first half of 2012.
Full Year Ended Dec. 31, 2011
•Total revenues were $254.6 million.
•Intellectual Property (formerly Micro-electronics) segment revenues were $213.4 million.
•DigitalOptics (formerly Imaging & Optics) segment revenues were $41.2 million.
The Company had a GAAP net loss of $19.3 million, or ($0.38) per basic share for 2011, which included a third quarter goodwill impairment charge of $49.7 million, all of which related to the DigitalOptics segment. 2011 Non-GAAP net income was $60.7 million, or $1.15 per diluted share.
Orora Design Technologies www.orora.com is a company focused on automating mixed-signal IC design and verification, and has announced that STARC, the Japanese electronic design consortium, has selected Orora’s Arana as the post-layout mixed-signal design verification solution for Japanese semiconductor industry’s next-generation STARCAD-AMS Analog/Mixed Signal reference flow. According to Tatsuya Shirakawa, researcher of STARC’s Mixed-Signal Design Group: We have identified automated behavioral model generation as the must have tool to address mixed-signal design verification. After extensive evaluation on a set of STARC benchmark circuits, we found that Orora’s Arana is the industry’s only viable automated behavioral model generation solution that meets all our strict criteria in terms of efficiency, accuracy, and ease of use.
Space Codesign Systems has announce the new integration of its SpaceStudio 2.2 ESL virtual platform technology with the European Space Agency(ESA)’s ASSERT Set of Tools for Engineering (TASTE). While the ESA is seeking to improve productivity by increasing automation of aerospace and satellite electronics development, the new extension and integration of SpaceStudio with TASTE enables engineers to model complex System on Chip (SoC) implementations. This integration works by allowing direct access to the design components of each node/board in the embedded system, thus dramatically reducing the development cycles.
CEVA has announced the availability of a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture. The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance. This level of performance facilitates the design of software-based modems and associated application software, for multiple communication standards, in parallel and in a real-time environment. The SDK platform was defined in collaboration with a Tier 1 handset OEM and is already in use with CEVA customers and partners.
Brian Bailey – keeping you covered
If you found this article to be of interest, visit EDA Designline
where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).
Also, you can obtain a highlights update delivered directly to your inbox by signing up for the EDA Designline weekly newsletter – just Click Here
to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you [grin]).