In the AMD booth on the DESIGN West exhibit floor, Xi3 unveiled its plans to enter the data center market with its microservers.
The airflow to cool the chassis is from the bottom of the container flowing upward and exhausting from the top toward the back. With cabling of ports A and B in each microserver, supervisory/management and peripheral connectivity, there is potential for shadowing / obstruction of airflow to microservers situated toward the back. In addition, the raising hot air from bottom RUs can add a couple of degrees to the microservers in the top RUs. Xi3 says they have resolved the airflow and cooling issues.
Figure 3 shows the side view
of the data center on wheels, which has power management, uplink ports,
cooling, UPS, etc., all self-contained.
Figure 3. Side view of the data center on wheels.
Container management, uplink and other supervisory connections are shown in Figure 4.
Figure 4. Back view of the container showing container management ports.
Xi3 uses a unique design of three mutually orthogonally-mounted boards, which it calls the Processor Board and the two I/O boards, Northbridge and Southbridge (with chip that controls all of the logic or I/O interfaces and interconnects for I/O). The result is the computer architecture with bare minimums of mother board and I/O boards. The processor board houses AMD's multicore processor, but Xi3 claims the designs are adaptable to any processor, including Intel's. The small form factor is also made possible by a clever use of solid state disks (SSD), shown below.
Xi3 claims this modular design for computers and servers allows an infinite amount of functions to be easily integrated into one core design. There appears to be a number of advantages to this design: adaptability to multiple use environments, heat dissipation, modular upgrades, mass-production and aesthetic appeal, to mention a few.
Figure 5. Xi3’s microserver (bottom surface has rails to mount the Zero module which provides additional storage capability in terabytes).