More than 29,000 attendees pushed the turnstiles at Moscone Center in San Francisco last week for the 42nd annual Semicon West, the semiconductor manufacturing equipment and materials vendors' annual tradeshow, and Intersolar North America, the solar equipment show that has been co-located with Semicon West for several years.
Attendance was down from 30,985 at last year's event, according to SEMI, the fab tool vendor trade group that organizes the event each year. About 14 percent of this year's attendees came to the event from overseas, according to SEMI.
The event featured 1,307 exhibition booths, up from 1,273 in 2011, according to SEMI. Some 690 companies from 21 countries exhibited at this year's show, including 51 new exhibitors, according to SEMI.
This year's show also featured a host of technical presentations on everything from packaging and yield management to lithography and was punctuated by keynote addresses from Intel Fellow Shekhar Borkar, Xilinx Chief Technology Officer Ivo Bolsens and Mark Pinto, general manager of Applied Materials' Energy and Environmental Solutions business unit, among others.
There was plenty of news, too. Though Intel and ASML made the most noise with the announcement that Intel is taking a 15 percent stake in the lithography tool supplier to boost R&D for 450-mm capable lithography tools and extreme ultraviolet systems, there were several other noteworthy developments.
A collection of EE Times' coverage from Semicon West appears bellow. For more photos captured during the event, scroll through the following pages.
Intel Fellow, Shekhar Borkar, director of extreme-scale technologies at the chip making giant, presents the Semicon West opening keynote on July 10. Borkar said exascale computing would become a reality before the decade is out, but that it won't live up to its full potential unless fundamental power consumption barriers are overcome (click on image to enlarge).
Semicon West stories:
Is the cost reduction associated with IC scaling over?
Xilinx CTO: Focus on what matters to customers
Ecosystem emerges around new mobile chip tech
Intel keynoter: Power consumption hurdles litter path to exascale computing
First 450-mm fabs to ramp in 2017, says analyst
Intel buys stake in ASML to boost 450-mm, EUV R&D
KLA wafer inspection system 'first domino to fall' on road to 450-mm
ASML won't get fooled again
ASML funding plan targets proposed 2018 EUV machine
ASML in talks with Samsung, TSMC on equity stakes
Applied tips PVD system for void-free copper structures