JEDEC, Jasper, eMemory, Samsung, STMicroelectronics, Mentor, Teledyne LeCroy, Globalfoundries, IBM, Intermolecular, Synopsys, Open-Silicon, ARM, EDAC, Sand 9, Sidense and Kilopass made the lineup today. See here for their news...
This is a roundup of news or activities in the past few days that may be of interest to people.
JEDEC Solid State Technology Association has announced the initial publication of its widely-anticipated Synchronous DDR4 (Double Data Rate 4) standard. JEDEC DDR4 (JESD79-4) has been defined to provide higher performance, with improved reliability and reduced power, thereby representing a significant achievement relative to previous DRAM memory technologies. The new DDR4 standard is available for free download from the JEDEC website at http://www.jedec.org/standards-documents/results/jesd79-4%20ddr4.
Jasper's annual user meeting will gather designers, verification engineers and engineering managers from around the world to share the latest verification best practices. Jasper's User Group meeting is an interactive, in-depth technical conference, which focuses on the needs of the Jasper Design Automation user community with the primary goal being to deliver immediately useful technical content. November 12 & 13 Cypress Hotel, Cupertino, CA. Register today at: http://www.jasper-da.com/JUG_2012
eMemory is preparing Multiple Times Programmable (MTP) embedded Non-Volatile Memory (eNVM) technologies. Having launched its leading NeoFlash and NeoEE technology, eMemory is now rolling out the all-new NeoMTP technology. NeoMTP technology has already passed silicon verification in 0.18um, 0.13um, and 80nm technology nodes from several international IC foundries in Asia, and is expected to go into mass production around the first half of next year.
Samsung Electronics has started foundry production of STMicroelectronics’ products using 32/28nm High-K Metal Gate (HKMG) process technology. Samsung Electronics’ foundry business has been selected by STMicroelectronics to provide it with products at the 32/28nm process node. The relationship has already resulted in taping-out of a dozen ST advanced system-on-chip (SoC) devices for mobile, consumer and network applications.
Mentor Graphics has collaborated with Teledyne LeCroy to deliver a new emulation platform for the verification of SuperSpeed Universal Serial Bus (USB) protocol Systems-on-Chip (SoCs). The combination of the Mentor® Veloce®2 hardware emulation technology and iSolveTM applications with Teledyne LeCroy’s Voyager M3i series SuperSpeed USB test solutions delivers a high-performance and productive environment for handling the verification of multiple SuperSpeed USB ports associated with today’s most challenging SoC designs. The goal of both companies is to help bring complex SuperSpeed USB-based SoC products to market on schedule, without compromising verification accuracy or performance.
Intermolecular says that GLOBALFOUNDRIES and IBM will leverage Intermolecular's High Productivity Combinatorial (HPC(TM)) technology, as the companies work to speed development of manufacturing technologies down to the 10nm node. Intermolecular's combinatorial technology allows many more tests to be done using a single wafer. This enables experimental data to be generated and analyzed with significantly greater speed and efficiency than a traditional development line, accelerating innovation in materials, processes, and device architectures.
Synopsys and Open-Silicon talk about a new chip that they say achieved 1.3 GHz performance for a quad-core ARM Cortex-A9 MPCore processor. The quad-core processor targeted at a set-top box application totaled more than three million instances with hundreds of macros, including four ARM NEON™ media processing engines. Implemented hierarchically, the design achieved a frequency of 1.3 GHz at the typical corner using 69 percent low-power long channel cells. It was optimized for a TSMC 40LP low-power process using ARM POP™ IP, comprised of standard cells and memories, as well as Synopsys' high-speed DesignWare® Embedded Memories.
The EDA Consortium (EDAC) Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 10.8 percent for Q2 2012 to $1593.0 million, compared to $1438.1 million in Q2 2011. Sequential EDA revenue for Q2 2012 increased 3.2 percent compared to Q1 2012, while the four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 12.0 percent. Companies that were tracked employed 28,205 professionals in Q2 2012, an increase of 5.6 percent compared to the 26,721 people employed in Q2 2011, and up 1.3 percent compared to Q1 2012. The Q2 number is an all-time high, surpassing the prior high point of 28,176 reported in Q3 of 2008.
Sand 9 has partnered with GLOBALFOUNDRIES to support high-volume manufacturing for Sand 9 products. Timing devices provide the ‘heartbeat’ for all electronic applications. Historically, this need has been met by quartz crystals. Sand 9’s micro-electromechanical systems (MEMS) timing devices provide an alternative with performance and quality improvements over legacy quartz crystal solutions. Unlike existing quartz crystal products, piezoelectric MEMS products can be integrated with semiconductor component devices for applications such as mobile and consumer electronics.
Sidense says that the United States District Court for the Northern District of California dismissed with prejudice all of Kilopass’ remaining business tort claims against Sidense. With the Court’s recent decision granting Sidense summary judgment of non-infringement, this ruling terminates the entire Kilopass case. This puts an end to Kilopass’ case in the district court.
Brian Bailey – keeping you covered
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