This is a roundup of news or activities in the past few days that may be of interest to people.
Worldwide semiconductor revenue is projected to total $311 billion in 2013, a 4.5 percent increase from 2012 revenue, according to Gartner, Inc. Due to economic headwinds and an inventory correction, the fourth quarter projections have been revised down from the previous quarter's forecast of $330 billion. Analysts have also reduced growth predictions for 2012 with semiconductor revenue expected to total $298 billion, down 3 percent from 2011. Gartner's third quarter forecast had put revenue at $309 billion for 2012, which would have meant an increase of 0.6 percent from 2011.
Agilent has updated its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices. GaN technology is becoming commonplace in today’s high-power RF communication circuits and automotive electronic components. Modeling these devices is challenging due to the impact of trapping and thermal effects on the device electrical characteristics. Existing GaAs models have been used as a first attempt to model GaN devices, but they are not accurate enough. The Angelov-GaN model, developed by Professor IItcho Angelov at Chalmers University of Technology, is quickly establishing itself as the industry’s solution to this dilemma.
Agilent also announced an eMMC (embedded multimedia card) compliance test application for embedded storage solutions. The Agilent N6465A eMMC test application helps memory design engineers validate and debug eMMC NAND flash memory cards faster by automating the execution of a series of parametric tests, including electrical and timing measurements, on Agilent Infiniium 9000, 90000A, 90000 X- and 90000 Q-Series oscilloscopes. The eMMC NAND flash memory technology can operate at a maximum clock rate of 200 MHz in high-speed mode and provides ultrafast memory for smartphones, tablets and other mobile devices. The eMMC standard is widely used. The Agilent N6465A eMMC compliance test application helps engineers test, debug and characterize physical-layer properties of eMMC memory to ensure compliance with the JEDEC JESD84-B451 specification.
CEVA will not submit any further proposal to acquire the operating business of MIPS Technologies, Inc. Gideon Wertheizer, CEO of CEVA, commented: "While CEVA's Board of Directors and management believed there was strategic merit in the combination of CEVA with MIPS, further increasing the purchase price would not meet our financial objectives. We believe it is in the best interests of our shareholders that our available cash be reserved for other potential opportunities in the future."
Mentor Graphics has announced that its Mentor®Embedded Nucleus® Innovate Program has added board support for STMicroelectronics devices. The Nucleus Innovate Program is designed to help businesses with less than $1M in annual revenue kick-start their embedded development projects. Qualified companies can accelerate their embedded system development with software provided at no cost, including the Nucleus Real Time Operating System (RTOS), the popular Sourcery™ CodeBench GNU toolchain, and now, ARM-based board support packages (BSPs) for STMicroelectronics devices. Mentor’s board support packages suit the STMicroelectronics STM32F103, STM32F105/7, STM32F205/7 and STM32L152 device families. M31 Technology
has joined the TSMC
IP Alliance. Its USB 3.0 PHY (physical layer) IP passed the high and low temperature tests and reliability verification for TSMC’s 40nm process, and completed the TSMC9000 quality assessment. The TSMC9000 library and IP quality management program mandates a set of quality requirements to be met before devices can be listed in TSMC’s IP catalog. M31 Technology develops proprietary 40nm USB 3.0 PHY IP using core devices and 1.8V I/O devices. The IP supports all super-speed, high-speed, full-speed and low-speed functions for USB3.0/USB2.0, and meets the USB-IF compliance test standard.Brian Bailey
– keeping you covered
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