These new algorithms mean that they can handle physics-driven
multi-etch steps including multi-material film stacks and multiple types
of etch. Etch types include redeposition (passivation), sputtering
(physical etching) and etch bias (lateral or chemical etching).
look at one example. David told me that this was an experiment he had
run on his laptop while on a plane journey. He didn’t tell me how many
time he had gone around the world, but I can assume this was probably
less than 10 hours. First we see how having run a model build it become
possible to measure dimensions of the fabricated devices.
it becomes possible to see the process sensitivity to variations. In
this experiment the <110> growth ratio is varied and it becomes
possible to visually see the impact of this. What we are looking at here
a study of FinFET Epitaxy and I particular the dependence on
pre-epitaxy fin erosion and epitaxial conditions.
course, looking at pictures is fun, but just as with functional
verification, we know the dangers of relying on looking at waveforms.
They can help you to visualize what is happening, but you want automated
analysis of results and the same is true here. In the chart below we
can see the results from all of the experiments.
explained that a tool such as this is not just for the foundries to
use, but also for the early adopters of the technology who can ensure
that their chips are likely to perform as expected before the fab has
even fully qualified the line. A third set of customers is the makers of
the fabrication process equipment who can better understand how their
equipment will perform under certain conditions.
Brian Bailey – keeping you covered
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