Editor's note: The author is chief technology officer at MonolithIC 3D Inc., which has developed a technology for 3-D ICs that is fundamentally different from through silicon via (TSV) technology.
Have you read some of the recent through silicon via (TSV) headlines?
Jan. 31—CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.
It is amazing to me that after so many years of development and effort and great presentations we are still not in a full production and still basic R&D as well as EDA still in infancy.
Most people in the industry consider Merlin Smith and Emanuel Stern of IBM the inventors of TSV based on their patent "Methods of Making Thru-Connections in Semiconductor Wafers," filed on December 28, 1964, and granted on September 26, 1967, as shown below in patent No. 3,343,256.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.