Editor's note: The author is chief technology officer at MonolithIC 3D Inc., which has developed a technology for 3-D ICs that is fundamentally different from through silicon via (TSV) technology.
Have you read some of the recent through silicon via (TSV) headlines?
Jan. 31—CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.
It is amazing to me that after so many years of development and effort and great presentations we are still not in a full production and still basic R&D as well as EDA still in infancy.
Most people in the industry consider Merlin Smith and Emanuel Stern of IBM the inventors of TSV based on their patent "Methods of Making Thru-Connections in Semiconductor Wafers," filed on December 28, 1964, and granted on September 26, 1967, as shown below in patent No. 3,343,256.
Join our online Radio Show on Friday 11th July starting at 2:00pm Eastern, when EETimes editor of all things fun and interesting, Max Maxfield, and embedded systems expert, Jack Ganssle, will debate as to just what is, and is not, and embedded system.