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Driving a stake into the heart of the 3-D packaging hype

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5/9/2012 05:43 AM EDT

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chipmonk0
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re: Driving a stake into the heart of the 3-D packaging hype
chipmonk0   5/9/2012 4:30:14 PM
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A good reminder of the logistics & business aspects of MCMs and how they would impact 3D stacking of Memory to Processors. But overwhelming technical advantages ( e,g. breaking the bandwidth / power consumption barrier ) for applications ( e,g. real time networked videogames ) in high volume systems ( Smartphones ) would drive the adoption of 3D stacks and solve the problems mentioned in the article ( they are trivial compared to staying on Moore's Law at this stage ).

krwada
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re: Driving a stake into the heart of the 3-D packaging hype
krwada   5/10/2012 3:43:37 PM
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We are rapidly approaching the fundamental limits of 2D planar device geometry. If we are inherently unable to go to the 3rd dimension ... does this mean that we, in the chip industry are doomed?

EDAvet
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re: Driving a stake into the heart of the 3-D packaging hype
EDAvet   5/10/2012 4:14:34 PM
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Erm, aren't companies already producing multi-die, stacked memory devices? "The iPhone's central processor is one of the components that features Apple package markings, but by decapsulating the device SI was able to identify it as a Samsung chip (as was exclusively reported by AppleInsider back in January), which features a three stacked die package containing the S5L8900 processor and two 512 Mbit SRAM dies. "

KurtShuler
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re: Driving a stake into the heart of the 3-D packaging hype
KurtShuler   5/10/2012 4:44:43 PM
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The iPhone APs are package-on-package (PoP), like most mobile phone APs. In PoP, each die is encased in its own (usually plastic) package, with exposed leads or pads. In TSV, the two (or more) silicon die are directly connected. Then the combined die are packaged. Here's a good set of pictures: http://www.semiwiki.com/forum/f142/wally-rhines-3d-ic-keynote-628.html

przemek0
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re: Driving a stake into the heart of the 3-D packaging hype
przemek0   5/10/2012 5:34:11 PM
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What about all those microcontroller-class chips? they are no longer limited to an 8-bit core with 1k RAM; for instance, the Broadcom chip in Raspberry Pi has 256MB memory and can run Linux just like that. I don't think it is 3D---my understanding is that they figured out a way to combine both logic and memory processes on the same die. This is a huge space---remember that the volume of microcontrollers is many times over that of conventional computing, except that nowadays what passes for microcontroller is as powerful as a decent desktop of few years ago.

selinz
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re: Driving a stake into the heart of the 3-D packaging hype
selinz   5/10/2012 9:44:05 PM
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I see most of the KGD work happening at the IDMs and most of the 3d packaging happening in conjunction with the packaging houses. The package (and sometimes test) houses will pretty much follow whatever the IDM's push but most packaging houses that I've seen don't really have much advanced test technology. This is likely to change as some of the bigger boys (like AMD) go more fabless. And to address another point, there is speed testing done at wafer level, particularly by captive processor module companies who don't want to throw away expensive chips. But alas, today's module is tomorrow's much lower cost IC.

chipmonk0
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re: Driving a stake into the heart of the 3-D packaging hype
chipmonk0   5/11/2012 8:34:34 PM
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"..But alas, today's module is tomorrow's much lower cost IC. ..". So true in the past but the 3D proponents are just hoping that Moores's Law will finally grind down if not for device fundamentals ( leakage ) then at least for lithography ( EUV ) or just the min. order size needed to justify a $ 10 billon Fab

rick merritt
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re: Driving a stake into the heart of the 3-D packaging hype
rick merritt   5/12/2012 1:01:40 AM
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This is an interesting analysis, but I have to say its more than the memory guys waiving the 3-D IC flag these days. It's big logic and fab folks like Altera, IBM, Qualcomm, TSMC, Xilinx and others. Are they all drinking the Kool-Aid?

resistion
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re: Driving a stake into the heart of the 3-D packaging hype
resistion   5/12/2012 4:18:23 AM
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Thermal is the most effective stake in the heart of 3DIC. Or the superthin dies.

simpletrading758
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re: Driving a stake into the heart of the 3-D packaging hype
simpletrading758   5/12/2012 5:08:28 AM
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