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Samsung Confirms 24 Layers in 3D NAND

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resistion
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for enterprise SSDs
resistion   8/14/2013 10:50:01 AM
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Engadget reports Samsung is targeting V-NAND for enterprise SSDs, so it's being positioned as an expensive NAND not the obvious lower cost per bit choice.

resistion
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Re:SK Hynix's comments
resistion   8/10/2013 9:07:22 PM
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resistion
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Re:SK Hynix's comments
resistion   8/10/2013 9:05:31 PM
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Seems SK Hynix had given indication of things to come a few months ago.

 

 

resistion
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Re: Going deeper
resistion   8/9/2013 7:39:40 PM
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If the technology were not at least theoretically capable of MLC, it might be hard to push. Extending vertically might be only way otherwise. It might make MLC harder by reducing read current. And there could be retention issues since there is no opportunity to confine charge vertically.

chipmonk0
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Re: Going deeper
chipmonk0   8/9/2013 11:34:07 AM
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@Peter : Thank you for your effort. Had suspected the same myself based on current status of 3D TSV technology. But the Blogosphere cannot be totally dismissed either.

Peter Clarke
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Re: Going deeper
Peter Clarke   8/9/2013 10:04:12 AM
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This from a spokesperson for Samsung.

"Samsung is not under consideration of applying through silicon vias in creating 3D V-NAND packages at this moment."

PC99
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Re: Going deeper
PC99   8/9/2013 10:02:49 AM
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This from a spokesperson for Samsung.

"Samsung is not under consideration of applying through silicon vias in creating 3D V-NAND packages at this moment."

 

 

 

Peter Clarke
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Re: Micron's comments
Peter Clarke   8/9/2013 6:21:50 AM
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Feels like Micron (and others) will start to move 3D-NAND up now Samsung is in the field

Peter Clarke
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Re: Going deeper
Peter Clarke   8/9/2013 6:21:01 AM
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Can any reader answer whether Samsung TCAT is capable of MLC?

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