Just in case you aren't "in the loop" -- the concept of Dried Frog Pills comes from Terry Pratchett's Discworld novels.
Dried Frog Pills are an hallucinogen that's used by the Bursar of Unseen University. The pills are carefully designed to make him hallucinate that he is sane -- and you cannot argue with logic like that :-)
@antedeluvian: I seem to remeber someone making the apt suggestion of a shiver of sharks. In my case would work for snakes as well.
A "shiver of sharks" is an "official" one -- they don't use that for snakes although I agree it would be apt (as would a "scream of spiders"). You can have a "knot of snakes" and a "rhumba of rattlesnakes".
@Junko: @DMcCunney, this is a fantastic list. We could certainly use this stuff for headlines and names for blogs/columns!
My rates are reasonable... :-)
Credit a few decades of learning to read between the lines on industry pronouncements. Too many are of the "And if you believe that, we have a bridge connecting Manhattan and Brooklyn you might be interested in..." variety,
A lot reduces to the old joke:
Q: What's the difference between the computer salesman and the used car salesman?
@cshore0: I too like "a murmuration of starlings" -- I'd not heard "a blessing of unicorns" before but that is perfect (unless you meet a bunch of the angry and mean kind, in which case you're in trouble [unless you're a virgin, in which case you have other problems]).
I do like a "community of cores" -- and David already mentioned "a wunch of bankers" :-)
My favorite digital design spoonerism is from logic testing: the stuck fault. I once heard someone mis-speak that one before a large IBM audience. For this reason, a lot of test theory guys prefer the term stuck-at fault because it's a lot safer to say.
Given the way I've seen a lot of software developed over the decades, I think I'll go with "Hackery". "Sillygism" is related to the kind of logical thinking I tend to associate more with digital design.
@betajet: Given the way I've seen a lot of software developed over the decades, I think I'll go with "Hackery".
I like it -- good one -- this blog was originally about names for groups of silicon chips -- but based on your input I'm thinking about doing a follow up column on names for different engineering professionals.
So what groups of engineering professionals spring to mind. You've already covered software developers and logic designers, how about Embedded Designers, Civil Engineers, Mechanical Designers, System Architects, Verification Engineers... Can you think of any more?
Note that I'm not asking for collective nouns for these folks at this stage (that will be the purposes of the follow-up column) -- I'm just looking for different types of engineers...
FYI: Disadvantages of BGAs. My chief worry is stresses on the balls caused by thermal mis-match between a BGA package and its underlying PC board. Those tiny solder balls don't flex like proper metal leads -- they crack. And who knows whether those mechanical stresses are causing tin whiskers, since that phenomenon is not well understood. "Oh my ears and whiskers!"
@betajet: My chief worry is stresses on the balls caused by thermal mis-match between a BGA package and its underlying PC board.
Being a string man, I'm going to totally ignore the opertunity to make jokes about stresses on your balls due to thermal management and instead ask if you've had any experiance with column grid arrays (CGAs) in which the solder balls are replaces with solder columns that mitigate against thermal stress (much like wearing looser undergarments :-)
I haven't had experience with column grid arrays. I would think you'd still have the concern that solder doesn't flex as reliably as copper or aluminum. Aren't there issues with maintaining column stiffness under stress? :-)
@betajet: Aren't there issues with maintaining column stiffness under stress? :-)
They are formed from a stiffer mix in the middle and a softer (more meltable) mix at the ends. My understanding is that they are very rugged and reliable and are used in things like military applications.
The PQFP and similar packages are better for this but still have limits to the thermal cycling issue -- This can be partly addressed with underfills for All the different types of packages -- When thinking of the ROHS aspects to the underfill -- remember that half as many boards will need to be built -- providing a much bigger impact in this Aspect of Underfill vs No Underfill -- also not using the corner three balls enhances life by at least a factor of two -- with underfill and no corner BGA ball use one can get 5-10x the life out of a BGA in an aerospace application.
Another very real aspect is the reduction in total solder joints to have as potential failure points with modern VLSI and FPGA packages in BGA and other high density devices. This is partly also addressed via X-ray laminography and conventional X-ray inspection techniques. Some aspects of an aircraft just do not permit BGA's in those locations however.
Those would require the carrier for the device -- in some applications it is a viable way to go -- in others where there is not room for the device carriers one must go with underfill and corners method, or look at other approaches -- these also have a bit more lead inductance than a solid ball, and thus affect signal and power integrity in some cases. One may even be left with the choice of mounting bare die on a hybrid package for some appliations (Very high temperature / High vibration - like the engines)