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iPhone 5s Innovates Beyond A7
9/23/2013

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Broadcom BCM4334 is 4.49 mm x 4.44 mm = 19.9 mm2.(Source: TechInsights)
Broadcom BCM4334 is 4.49 mm x 4.44 mm = 19.9 mm2.
(Source: TechInsights)

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krisi
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8 die stack
krisi   9/24/2013 6:29:01 PM
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8 die stack? I didn't realize people stack so many chips now

Caleb Kraft
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hidden changes
Caleb Kraft   9/24/2013 5:04:01 PM
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it is always interesting to see what changes internally aren't bragged about. Sure, they give a big speech about new big features, but we sometimes forget that often each component has been updated in some way too. 

rick merritt
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Hail Canada
rick merritt   9/24/2013 3:50:52 PM
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Thanks for weighing in on these pieces of the puzzle, TechInsights!

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