If you design integrated circuits or develop/customize tool flows, then read on.
The 18th Annual Si2 conference -- a.k.a. Si2Con -- takes place Tuesday, Oct. 8, in Santa Clara, Calif. This Si2Con is packed with the latest and greatest advances in standards that really affect your world, presented by world-leading experts in their field. Here are some quick session highlights.
OpenAccess -- Easier to Work With Than Ever Before: The new OA scripting framework opens up design data to the same level of access and control as C++ experts have previously enjoyed, now using popular scripting languages that all work off a common and open standard API framework. If you're new to OpenAccess, come to learn about how to get started. If you're an expert, engage with other experts on the latest features supporting the most advanced chip design needs.
The Promise of a Universal PDK -- Write Once, Use Many: The need to better manage PDK development across multiple foundries, EDA vendors, and users continues to grow with cost and complexity. This month's release of the Open Process Spec (OPS) is a major milestone and completes the set of standards in the OpenPDK vision. Learn how ISDA Alliance partners are automating the creation of PDKs with OPS, as well as how the ongoing topic of Pcell interoperability is being tackled with two new complementary emerging standards.
System-Level Power-Aware Design: Chip designers understand the critical importance of continued advancements in low-power design methodology and the need for standardization at the system level in both modeling and formats. This session dives into the needs of system-level power standards, summarizes power modeling standards developed by the LPC, and presents a unique software perspective on requirements as we expand our view to system-level standardization.
Automated DRC/DFM Runset Generation and FinFET Parasitic Extraction: The OpenDFM 2.0 standard has been proven to deliver excellent interoperability across EDA vendor platforms while reducing lines of code development by up to 5x. Now, IBM will share how it is automating its DRC runset creation using OpenDFM. After that, hear about the latest FinFET and FD-SOI additions to the Open Parasitics (OPEX) format and database standard and how you can use it to improve accuracy and reduce costly errors.
SPICE Models Come to Si2: At DAC, Si2 announced the addition of the Compact Model Coalition (CMC) to the Si2 family. The CMC's 36 member companies have been specifying, funding, and testing the semiconductor industry's standard SPICE models for 17 years, playing a crucial role in all parts of the semiconductor/EDA supply chain. Si2Con's keynote will be delivered by Dr. Keith Green, TI, chairman of the CMC, who will explore the synergies spanning OpenPDK, OpenAccess, OpenDFM, and Open3D. Please come to welcome CMC members into Si2 and explore these new opportunities.
Registration and agenda details can be found here.