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Channeling Higher Power Into Smaller Packages

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docdivakar
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Re: Channeling Higher Power Into Smaller Packages
docdivakar   3/14/2014 2:10:30 AM
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Optimizing the layout to get a nearly isothermal temperature distribution is a given these days in power conversion. The industry has evidenced a good pace of progress in this area not only in X-Y but also in the Z-direction as well. With that accomplished, thermal simulations and experimental measurements must therefore demonstrate whether encapsulating the power converter components is really a value-adding effort. The data sheet for the BCM module shows heatsink for the BCM, so one must wonder whether cooling requirement is less for the open frame version with / wiithout heatsink than that for the encapsulated one!

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