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On-Chip Interconnect Costs Spawn Research
3/26/2014

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'Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes,' Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.
"Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes," Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.

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