Design Con 2015
Breaking News
On-Chip Interconnect Costs Spawn Research
3/26/2014

Image 1 of 2      Next >

'Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes,' Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.
"Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes," Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.

Image 1 of 2      Next >

Return to Article

View Comments: Threaded | Newest First | Oldest First
December 2014 Cartoon Caption Contest: White Smoke Is Rising!
December 2014 Cartoon Caption Contest: White Smoke Is Rising!
"Remember when someone promised us change a few years ago? That's all we have left!"
2 comments
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week