STMicroelectronics uses a single MEMS die for the six-axis accelerometer/gyroscope, shrinking the size of the six-axis function by more than 30% over its previous combo solution, which used two dice.
The component uses glass-fit bonding, but STMicroelectronics also uses gold-gold thermo-compression bonding for the sealing of some of its MEMS die, enabling a reduction of the sealing frame and thus shrinking the die size.
The accelero/gyro sensor in the STMicroelectronics LSM9DS0 nine-axis IMU.
(Source: System Plus Consulting report from December 2013)
Next page: Bosch does it all in-house