The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
STMicroelectronics uses a single MEMS die for the six-axis accelerometer/gyroscope, shrinking the size of the six-axis function by more than 30% over its previous combo solution, which used two dice.
The component uses glass-fit bonding, but STMicroelectronics also uses gold-gold thermo-compression bonding for the sealing of some of its MEMS die, enabling a reduction of the sealing frame and thus shrinking the die size.
The accelero/gyro sensor in the STMicroelectronics LSM9DS0 nine-axis IMU.
(Source: System Plus Consulting report from December 2013)
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