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Game-Changing Breakthrough at IEEE S3S 2014

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beinglass
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3D device technology
beinglass   9/11/2014 8:52:04 PM
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Looks like recently 3DIC is gaining momentum. This new development will make Monolithic 3D close to reality.

bec0
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Re: Heat spread
bec0   9/10/2014 9:03:59 PM
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@Resiston. Agreed, but heat spreaders/shield layers with conductive cooling (lateral) and use of the Vss/Vdd lines and interlayer vias (lateral and vertical) can handle a lot of heat. See IEDM2012 14-2, as well as Y. Won Compound Semi IC Symp 2013.

resistion
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Heat spread
resistion   9/10/2014 3:55:03 PM
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The heat spreading results in hot transistor planes with memory in between, not so desirable.

betajet
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Re: Word of the day
betajet   9/10/2014 3:37:21 PM
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Postprandial is a good cat word, e.g., "Tiger is taking his postprandial nap" or "Snowball is having her postprandial wash".

Max The Magnificent
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Word of the day
Max The Magnificent   9/10/2014 2:57:55 PM
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@Zvi: ...for the attendees' postprandial enjoyment...

I just learned a new word -- I'll have to try using it in a sentence when i get home tonight LOL

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