Intel and Micron say they’ve developed a new class of memory technology, but there’s more talk about all of the things 3D XPoint memory might be able to do, and little detail of what it actually is. Speculation is inevitable.
Industrial networks are increasingly vulnerable to cyber attacks. Their security requires a multi-layered approach.
Wearables have the power to transform the world around us--to interact on our behalf with other 'smart' devices that are increasingly common.
MacSpace is a collaborative R&D project aiming to research and develop a many-core DSP chip and computer for use in space.
Faced with the challenges of new materials and new components, PCB designers must also deal with continuing electromagnetic compatibility and interference problems.