Embedded Systems Conference
Breaking News
On-Chip Interconnect Costs Spawn Research
3/26/2014

Image 1 of 2      Next >

'Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes,' Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.
"Interconnect performance/area/cost scaling the foremost issue for 10nm and 7nm nodes," Geoffrey Yeap, vice president of technology at Qualcomm, said in a keynote at the 2013 International Electron Devices Meeting.

Image 1 of 2      Next >

Return to Article

View Comments: Oldest First | Newest First | Threaded View
Most Recent Comments
bobdvb
 
Wilco1
 
DeeCee430
 
DeeCee430
 
moronda
 
rick merritt
 
Bruzzer
 
traneus
 
akkaraju

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed