Intel's $4.1 billion investment in ASML is not unlike the waiter bringing the check before serving the meal. But it had to be this way.
ASML is willing to sell another 10 percent of the company to other chip makers who are willing to kick in for the development of 450-mm litho tools and EUV. The firm is currently in discussions with both Samsung and TSMC on taking a piece of the action. If those firms decline to participate, or agree to participate but don't collectively buy the entire 10 percent remaining that ASML is willing to sell, ASML will invite others to participate. (As a condition imposed by ASML, Intel's stake in the company is limited to a maximum of 15 percent.)
The whole thing is not unlike a waiter bringing the check before serving the meal. But it had to be this way. ASML was not going to put out the investment required on 450-mm without money up front. And owing to its dominant market share in leading-edge lithography tools, there will be no 450-mm chip production without ASML.
Intel has the most to gain from the move to 450-mm. Stacy Smith, the company's chief financial officer, said this week that it expects the move to 450-mm to save the company more than $10 billion in manufacturing costs. Still, Intel alone takes ASML up on its offer, its deep pockets will no doubt also benefit rivals who will then get access to 450-mm and EUV lithography tools.
That's where the 15 percent stake comes in. Even if Intel is the only chip firm to directly support ASML's development of these technologies, the world's biggest chip maker will get a piece of the action every time a rival pulls out its checkbook to buy one of the new tools. In the words of a spokesman for ASML, Intel now has real skin in the game and even more interest in seeing the development of these technologies succeed.
Whether Samsung, TSMC or any other chip vendor takes ASML up on its offer remains to be seen. On one hand, it can be argued, there is little incentive for them to do so at this point. Especially now that Intel has put its money where its mouth is, there is little doubt that ASML will develop 450-mm tools (though for EUV, the case is far from closed). Once ASML has the tools available, they will presumably be happy to sell them to Samsung, TSMC and anyone else who wants them and has the means to pay.
But Samsung and TSMC would be wise to pony up and get involved. When 450-mm tools become available, the leading-edge chip makers will want them ASAP. While there is no publicly disclosed intent to give Intel right of first refusal on new tools—other than those Intel has already committed to buying—come sense dictates that you take care of any part owners of your company before shopping them to the general public. If Samsung and TSMC don't get in on the ground floor, they may end up waiting until Intel is pretty sure it has all of the tools it wants before they get their hands on any.
Also, Intel's 15 percent stake in ASML—as well as any stake Samsung and TSMC may take—is in non-voting shares. But again, common sense dictates that the customer who is helping to foot the bill for the development of the technology will have a louder voice when it's time to make development decisions. Samsung, TSMC and any other firm that does not get in on the action may find itself outside looking in.
In my opinion, I am sure that all of the companies you mention would like to ask for money up front. I am not sure that they can. ASML holds all of the cards in litho. I am not sure any other company would be negotiating from such a position of strength.
I agree Intel wants larger wafers. Racing process is increasing their number of process steps driving moore inefficiencies into their fabrication process.
History shows Intel will bypass disruptive innovations at adoption stage if an alternate method is farther along its development curve;
multi dice package vs. multicore dice comes to mind. Sound strategy reducing manufacturing risk this way. Especially when the moore costly solution is concealed by monopoly accounts practice.
Note of interest at Semicon session Lithography: Extending Double Patterning, Industrializing EUV and Complimentary Technologies in which Borodovsky presented, is that EBEAM was seen as the compliment to 193i & Directed Self Assembly not EUV.
I personally believe Intel will harvest their current lithography investment until applied science passes through innovation phase to identiy the next process commercial industrial art.
I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.
EUV is part of the deal. But phase one is 450. I think that is what Intel wants more. Intel's Yan Borodovsky spoke today about using complementary lithography, including 193 immersion, DSA and perhaps other technologies. But I think Intel is just trying to cover its bases. Intel still wants EUV badly. But it seems to me that the jury is still out on EUV's economic viability.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments