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ASML: We won't get fooled again

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CityChipMan
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re: ASML: We won't get fooled again
CityChipMan   7/12/2012 7:55:32 AM
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I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.

resistion
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re: ASML: We won't get fooled again
resistion   7/12/2012 8:03:47 AM
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No support from Intel to ASML will solve EUV defects.

mcgrathdylan
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re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 8:22:29 AM
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BTW, that was meant to be "level the playing field" above.

resistion
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re: ASML: We won't get fooled again
resistion   7/12/2012 9:07:35 AM
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Did ASML set a precedent for other companies? Will TEL, Applied, Nikon, Lam, KLA-Tencor, ask the same?

Bruzzer
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Freelancer
re: ASML: We won't get fooled again
Bruzzer   7/12/2012 4:49:00 PM
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I agree Intel wants larger wafers. Racing process is increasing their number of process steps driving moore inefficiencies into their fabrication process. History shows Intel will bypass disruptive innovations at adoption stage if an alternate method is farther along its development curve; multi dice package vs. multicore dice comes to mind. Sound strategy reducing manufacturing risk this way. Especially when the moore costly solution is concealed by monopoly accounts practice. Note of interest at Semicon session Lithography: Extending Double Patterning, Industrializing EUV and Complimentary Technologies in which Borodovsky presented, is that EBEAM was seen as the compliment to 193i & Directed Self Assembly not EUV. I personally believe Intel will harvest their current lithography investment until applied science passes through innovation phase to identiy the next process commercial industrial art. Mike Bruzzone Camp Marketing

mcgrathdylan
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re: ASML: We won't get fooled again
mcgrathdylan   7/12/2012 6:34:37 PM
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In my opinion, I am sure that all of the companies you mention would like to ask for money up front. I am not sure that they can. ASML holds all of the cards in litho. I am not sure any other company would be negotiating from such a position of strength.

sprite0022
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Manager
re: ASML: We won't get fooled again
sprite0022   7/13/2012 2:53:53 AM
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nikon's DSLR bussiness is booming, no need to bother with litho tools. this is waste of money anyway.

the_floating_ gate
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re: ASML: We won't get fooled again
the_floating_ gate   7/13/2012 6:11:48 AM
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We won't get fooled again either...LOL http://www.eetimes.com/electronics-news/4217553/Report--TSMC-may-beat-Intel-to-3-D-chips

the_floating_ gate
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re: ASML: We won't get fooled again
the_floating_ gate   7/13/2012 6:24:34 AM
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The report by the Taiwan External Trade Development Council (TAITRA) quoted an anonymous source saying that TSMC's projected delivery of 3-D chips matches that of Intel, the world's biggest chip maker. Intel announced with great fanfare in May that it would begin high-volume production of 3-D chips using tri-gate transistors by the end of the year. Did you ever correct this story ? You never did - and now you're commenting on ASML? FYI Solid State has an excellent site: http://www.electroiq.com/semiconductors.html

mcgrathdylan
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Blogger
re: ASML: We won't get fooled again
mcgrathdylan   7/13/2012 4:25:28 PM
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@floatinggate- In fact I did publish a response taking responsibility for my error in the case of reporting on that TAITRA report. You can find it here. http://www.eetimes.com/electronics-blogs/semi-conscious/4217696/Setting-the-record-straight-on-the-Intel-TSMC-3-D--race-

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