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ASML doubles down on EUV

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double-o-nothing
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re: ASML doubles down on EUV
double-o-nothing   10/21/2012 12:17:36 PM
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With only a few photons absorbed per sq. nm., no wonder the edge roughness is so persistent at the nm scale.

any1
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re: ASML doubles down on EUV
any1   10/22/2012 6:55:12 PM
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It's not just the consolidation of a couple of equipment companies. Remember ASML invited Intel, Samsung, and TSMC to become part owners as well. So now we have everything from design through fabrication AND the equipment used to do it all intertwined together. At some point if the cost of making EUV work is so costly then maybe it's just not viable right now. Maybe the single minded pursuit of EUV litho is draining investment out of the semi industry that could better be spent elsewhere.

resistion
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re: ASML doubles down on EUV
resistion   10/25/2012 6:43:50 AM
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The Sematech TWG showed this year that the low thickness of EUV resist is also a significant factor.

resistion
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re: ASML doubles down on EUV
resistion   10/25/2012 12:43:19 PM
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And as the resist becomes thinner and thinner, for smaller CD design rules, fewer and fewer photons are absorbed per sq. nm, exacerbating the shot noise and LER issues.

resistion
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re: ASML doubles down on EUV
resistion   11/17/2012 1:52:27 PM
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Nikon may be planning a coup against ASML in EUV. http://www.nikonprecision.com/ereview/spring_2012/news-04.html

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