Where do Chip heads connect? At DesignCon2011 at the Santa Clara Convention Center. Today a begins a week of intensive panels, presentations and tutorials on bleeding-edge IC design, high-speed interconnect and test issues and more.
Rambus CEO Harold Hughes kicks off the keynotes today with an address at noon. He'll be followed by Jay Alexander from Agilent (Tuesday) and Ivo Bolsens from Xilinx.
Other highlights? Don't miss our "teardown smackdown" Tuesday at 2 in the ChipHead Theater as EDN's Paul Rako and I open and analyze the Dell Streak and Samsung Galaxy tablets (watch the preview below). We're followed at 3 p.m. by EDN's Brian Dipert and iFixit CEO Kyle Wiens who will tear apart the Microsoft Kinect.
That's followed by a fireside chat with Tektronix CEO Amir Aghdaei, who will discuss how the engineer's job is affected by new technology trends driving our industry.
If you can't make it in person, tune in Tuesday at 9 a.m. PST for special EE Times live coverage from the DesignCon press room on UStream. We'll broadcast live for three hours as we interview engineers, executives, key editors and others from the industry. We'll also continue coverage in archive form at our EE Times video page.
And if you're there in person, please say hi. I'd love to chat about what you're designing these days!