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FD-SOI is out of the woods and will begin exponential growth in 2016. What started with a 3-D fix for Intel hitting the leakage wall with bulk silicon, followed by claims of an easier way from companies, have finally morphed full circle. Now the SOI Consortium members Freescale, IBM, Imec and Soitec itself are prototyping 3-D fins atop a Soitec wafers to super-fully-deplete the channel.
Carbon nanotubes have once again become popular as the replacement for silicon, which is reaching the end of the International Technology Roadmap for Semiconductors. After 15 years, researchers are returning to nanotubes with a vengeance. Last year IBM claimed “nanotube transistors by 2020 or bust” and has already demonstrated a working nanotube transistor with a 9-nanometer channel and a clear path down to the 1.8-nanometer node.
It’s taking a while to sow the seeds for energy harvesting. While much industry focus may be on powering the Internet of Things, the future may be bigger for energy harvesting.
Hewlett Packard Enterprise announced Synergy, a server blade system with integrated software to ease the job of managing jobs across arrays of processors and hard and solid-state disks.
Low power wide area networks for the Internet of Things have been attracting new entrants and investors at a heady pace with unannounced offerings still in the pipeline for 2016 trying to enable new IoT apps by undercutting costs and battery life for cellular and WiFi.
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