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Earlier this week, when the Department of Transportation laid out cybersecurity guidance for carmakers, U.S. Transportation Secretary called cybersecurity “a safety issue.” The latest survey, however, found that automakers still haven’t made cybersecurity a priority in vehicle development.
Despite challenges, ARM’s head of silicon research remains optimistic on the outlook for semiconductors at 3nm and beyond.
As automakers start adding more and more ADAS features, the complexity of software code and SoCs deployed inside vehicles has been skyrocketing. Chip suppliers are under tremendous pressure to prove the functional safety of their products.
TSMC will probably make nearly all of the A10 and A11 processors for Apple this year and next because of a competitive advantage the Taiwan foundry has gained in packaging technology called InFO (Integrated Fan Out), according to analysts.
To simplify IoT design with embedded security, ARM has developed a suite of cores, software, and services to handle chip to cloud interaction.
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