Embedded Systems Conference
Breaking News
View Comments: Newest First | Oldest First | Threaded View
More Blogs from News & Analysis
Telco operators at Mobile World Congress called for a “level playing field” with apps/service providers such as Google, Facebook and Amazon.
Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
By almost any measure, the job market appears to be looking very good right now for embedded engineers. But not for everyone.
The proposed merger of NXP and Freescale creates a embedded chip vendor that is significantly bigger than most, but not all, its rivals and not substantially different.
Intel announced a new family of SoCs and modems for mobile devices under its Atom brand, targeting low to premium markets. The chip giant hopes to win a large share of the mobile space with highly integrated processors and excellent graphics.
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week