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Researchers are on the road to creating a single-photon emitter and a single-molecule detector.
The HoloLens processing unit uses 24 Tensilica DSPs and an assortment of accelerators to deliver a trillion pixel-operations per second, Microsoft disclosed.
Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.

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